Company Overview

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About the Company

[Summary] 硅片切割,晶圆切割,特殊切割加工

沈阳和研科技股份有限公司成立于2011年,是一家专业从事半导体专用设备及配件耗材的研发、生产、销售、服务于一体的*专精特新“小巨人”企业、高新技术企业、辽宁省瞪羚企业。
和研科技作为国内半导体磨划设备专业制造商,公司主营HG系列晶圆研磨机、DS系列精密划片机、JS系列全自动切割分选一体机及其它半导体专用设备。我们专注于硅片、玻璃、陶瓷、砷化镓、铌酸锂,金属等硬脆材料的精密磨划加工。主要应用于集成电路、光电器件、分立器件、传感器、LED、光学、制冷、光通讯、医疗等行业。
公司总部位于沈阳市,2021年成立苏州和研精密科技有限公司,在南京、苏州、南通、淄博、成都、厦门、西安、南昌、东莞等地设有销售及服务中心。客户的需求是公司发展的强劲动力,我们的目标是通过提供适合市场的创新产品、合理的技术方案、高效贴心的售后服务,*终成为您值得信赖的合作伙伴!

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和研科技 Financing History (2 rounds)

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B+轮
Capital Market Favor
Latest Financing Round
  • Date: ?
  • Amount: 融资金额未公开
  • Investor: 国家集成电路产业投资基金

和研科技 How Fast Is Hiring Growing? (41 open positions)

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?
Growth Rate
2026 vs 2025
  • 2025: Up 141%
  • 2024: Up 17%
  • 2023: Up 133%
  • 2022: Down 44%
和研科技 Year-by-Year Hiring:
* Hiring was generally low during 2020-2022 due to the pandemic
和研科技 Campus Recruitment & Advanced Degree Talent Demand
Interns 2 Master's 12
Note: How fast is hiring at 沈阳和研科技股份有限公司 growing? 和研科技2025: 118 openings (up 141%), 2024: 49 openings (up 17%), 2023: 42 openings (up 133%), 2022: 18 openings (down 44%), 2021: 32 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

和研科技 Master's Degree Job Demand Analysis

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?
Growth Rate
2026 vs 2025
  • 2025: Up 1100%
  • 2024: Down 33%
  • 2023: Flat 0%-
和研科技 Master's Hiring by Year:
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 沈阳和研科技股份有限公司 growing? 和研科技Master's recruitment over the years: 2025: 24 openings (up 1100%), 2024: 2 openings (down 33%), 2023: 3 openings (flat), 2022: 3 openings.

和研科技 R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 沈阳和研科技股份有限公司? Based on an analysis of 和研科技's job postings over the past year, "计算机/网络/技术类" demand: 22.2%, "机械/仪器仪表类": 21.4%, "其他(研发和技术类)": 12.7%, "电气/能源/动力类": 10.3%, "电子/电器/通信技术类": 9.5%, "生物/制药/化工/环保类": 2.4%. For reference only.

和研科技 — What Are the Salaries Like? (126 records)

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和研科技 Salary Overview
salary range: 2K - 30K, 65.1% of roles pay ¥8-15K
Note: salary statistics are based on 126 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 沈阳和研科技股份有限公司?和研科技65.1% of positions earn 8-15K, Undergraduate salary: ¥。Shenyang salary ranking: #282,计算机/网络/技术类 average salary ¥12.9K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of 和研科技

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Are salaries high at 沈阳和研科技股份有限公司? We provide: 软件工程,机械工,工艺工程,装配,c#,售后,电气,研磨,设计工程师,机械设计,开发工程师,钳工,销售,算法,软件开发,采购,qe,厂务,学工,实习生. Click to view detailed salary analysis by job.

和研科技 Related Industry Tags

Job Category

  • 计算机/网络/技术类
    22.2% of total 22.2%
  • 技工类
    21.4% of total 21.4%
  • 机械/仪器仪表类
    21.4% of total 21.4%
  • 其他(研发和技术类)
    12.7% of total 12.7%

Education

  • 本科
    57.9% of total 57.9%
  • 大专
    21.4% of total 21.4%
  • 硕士
    20.6% of total 20.6%

Experience

  • 3-5年
    52.4% of total 52.4%
  • 5-10年
    24.6% of total 24.6%
  • 1-3年
    16.7% of total 16.7%
  • 不限
    6.3% of total 6.3%
View Detailed Analysis

What does 沈阳和研科技股份有限公司 require? Who is 和研科技 hiring? 和研科技 recruitment: 计算机/网络/技术类占比最多占22.2%,其次是技工类占21.4%. What education can get in at 和研科技? 本科占比最多占57.9%,其次是大专占21.4%. High education required at 和研科技? 硕士占20.6%. Work experience required at 和研科技? 3-5年占比最多占52.4%,其次是5-10年占24.6%. Where are the job locations at 和研科技? 沈阳占比最多占80.2%,其次是嘉兴占9.5%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 3,429.3579万(元)
Legal Representative: 袁慧珠
Date Established:
Credit Code: 91210105564689755B
Registered Address: 辽宁省沈阳市皇姑区塔湾街11号(塔湾街11号)信悦汇A1座20层2005-2单元

Partners & Suppliers

向其提供集成电路封装划片机设备,用于晶圆切割工序。 Source
合作客户 半导体封测
向其供应划片机设备,用于先进封装产线。 Source
合作客户 半导体封测
为其提供划片机,支持其封装测试业务。 Source
合作客户 半导体封测

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