Company Overview

Development Stage

About the Company

和芯半导体科技聚焦集成电路芯片测试领域,从芯片测试方案,半导体测试板,探针卡,测试程序开发, 调试和量产导入,测试接口结构件,软件程序开发和调试,提供软硬件一站式测试解决方案及服务。通过独立研发设计,自主生产销售,提供产品到集成电路芯片设计公司,晶圆厂,封装测试厂及提供专业的售后服务。
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Information is aggregated from the web and may not be exact. For reference only.
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和芯半导体科技 Recruitment Overview / Current Status (31 open positions)

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Note: How fast is hiring at 和芯半导体科技(苏州)有限公司 growing? 和芯半导体科技2025: 18 openings, 2023: 1 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

和芯半导体科技 R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 和芯半导体科技(苏州)有限公司? Based on an analysis of 和芯半导体科技's job postings over the past year, "电子/电器/通信技术类" demand: 39.7%, "计算机/网络/技术类": 30.2%, "其他(研发和技术类)": 20.6%. For reference only.

和芯半导体科技 — What Are the Salaries Like? (63 records)

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salary range: 3K - 30K, 60.3% of roles pay ¥10-20K
Note: salary statistics are based on 63 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 和芯半导体科技(苏州)有限公司?和芯半导体科技60.3% of positions earn 10-20K, Fresh graduate salary: ¥3.8K。电子/电器/通信技术类 average salary ¥12.1K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of 和芯半导体科技

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Are salaries high at 和芯半导体科技(苏州)有限公司? We provide: 项目经理,硬件,设计工程师,销售,te,pcb工程师,财务,pcb设计,测试工程,oc,会计,ae,fa,pm,人事,售后,实习生,组装,行政,运营. Click to view detailed salary analysis by job.

和芯半导体科技 honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

和芯半导体科技 Related Industry Tags

Job Category

  • 电子/电器/通信技术类
    39.1% of total 39.1%
  • 计算机/网络/技术类
    29.7% of total 29.7%
  • 其他(研发和技术类)
    20.3% of total 20.3%
  • 项目管理类
    15.6% of total 15.6%

Education

  • 本科
    75% of total 75%
  • 大专
    15.6% of total 15.6%
  • 高中
    9.4% of total 9.4%

Experience

  • 1-3年
    40.6% of total 40.6%
  • 3-5年
    35.9% of total 35.9%
  • 5-10年
    21.9% of total 21.9%
  • 应届生
    1.6% of total 1.6%
View Detailed Analysis

What does 和芯半导体科技(苏州)有限公司 require? Who is 和芯半导体科技 hiring? 和芯半导体科技 recruitment: 电子/电器/通信技术类占比最多占39.1%,其次是计算机/网络/技术类占29.7%. What education can get in at 和芯半导体科技? 本科占比最多占75%,其次是大专占15.6%. Work experience required at 和芯半导体科技? 1-3年占比最多占40.6%,其次是3-5年占35.9%. Where are the job locations at 和芯半导体科技? 苏州占比最多占79.7%,其次是西安占20.3%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 500万(元)
Legal Representative: 全光浩
Date Established:
Credit Code: 91320594MA7HF0XM7D
Registered Address: 中国(江苏)自由贸易试验区苏州片区苏州工业园区兴浦路333号纳米健康产业园1号楼201室

Partners & Suppliers

采购电源管理芯片及LED驱动芯片用于智能手机及终端产品。 Source
合作客户 消费电子
采购电源管理芯片用于基站及通信设备。 Source
合作客户 通信设备
提供芯片封装与测试服务。 Source
供应商 封测服务
提供晶圆代工服务,用于生产电源管理芯片等产品。 Source
供应商 晶圆代工

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和芯半导体科技 Competitors (Similar Companies)

集成电路/IC 晶圆测试 探针台 探针卡
半导体 微电子 光电 晶圆测试
半导体 芯片设计 芯片 半导体测试
半导体 探针卡 探针 电子设备
半导体设计 芯片设计 显示面板 半导体
闪存 探针卡 研发 探针
“集成电路测试接口供应商”
“A leading substrate manufacturing service provider offering comprehens”
“Focused on the R&D, production, and sales of specialized semiconductor”
集成电路/IC BGA 晶圆制造 探针卡
电子厂/电子 微电子 EMS PCBA
“设备研发生产商”
半导体测试 自动化组装 顶针 探针
集成电路/IC 集成电路晶圆 晶圆级芯片封装 晶圆
“半导体芯片研发制造商”

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