苏州亿铸智能科技有限公司 R&D strength - Jobui

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亿铸科技 R&D strength (tech talent demand and pay)

What is the demand for tech talent at 亿铸科技? Based on job postings in the past year, “计算机/网络/技术类”占42.7%，“电子/电器/通信技术类”占40.3%，“其他（研发和技术类）”占16.1%，“生物/制药/化工/环保类”占6.5%，“美术/设计/创意类”占1.6%. For reference only.

计算机/网络/技术类 salary: 88.7% of positions pay ¥30-50K以上/month

11.3% 20-30K 67.9% 30-50K 20.8% 50K以上

计算机/网络/技术类 talent demand: 53 positions, 42.7%, hot jobs:

Master's degree job demand analysis at 亿铸科技 (More)

2025: Up 10%
2024: Up 122%

亿铸科技 master's hiring over the years:

2023 9 positions 2024 20 positions 2025 22 positions 2026 ? *** 

* Hiring volume was generally low in 2020-2022 due to the pandemic

Master's salary 򀀩

亿铸科技 honors, qualifications & industry associations

独角兽企业

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Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

Talent Demand Trend Analysis More

集成电路设计

算力

处理器芯片

半导体设计

idm芯片

智能化

集成电路/IC

微电子

芯片

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