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Company Overview

Development Stage

About the Company

亿铸科技成立于2020年6月,致力于用存算一体架构设计AI大算力芯片,将新型存储器ReRAM和存算一体架构相结合,通过全数字化的芯片设计思路,在当前产业格局的基础上,提供一条更具性价比、更高能效比、更大算力发展空间的AI大算力芯片换道发展新路径。

亿铸科技拥有非常优秀的研发、工程及顾问团队。研发能力覆盖了工艺器件、架构设计、电路设计和软件生态等全链条;工程团队核心成员平均拥有25年以上的高端集成电路设计和量产经验,有着丰富的应用和产品化实战经历。

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亿铸科技 Financing History (1 rounds)

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A轮
Capital Market Favor
Latest Financing Round
  • Date: ?
  • Amount: 1亿人民币
  • Investor: 行至资本,Prosperi...

亿铸科技 How Fast Is Hiring Growing? (20 open positions)

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Note: How fast is hiring at 苏州亿铸智能科技有限公司 growing? 亿铸科技2025年61个(下降25%),2024年81个(增长25%),2023年65个(增长282%),2022年17个(增长1600%),2021年1个. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

亿铸科技 Master's Degree Job Demand Analysis

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Growth Rate
2026 vs 2025
  • 2025: Up 10%
  • 2024: Up 122%
亿铸科技 Master's Hiring by Year:
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 苏州亿铸智能科技有限公司 growing? 亿铸科技历年硕士招聘职位量:2025年22个(增长10%),2024年20个(增长122%),2023年9个. 亿铸科技在苏州硕士人才需求中排名第243, 亿铸科技硕士工资大部分在30-50K以上.

亿铸科技 R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 苏州亿铸智能科技有限公司? Based on an analysis of 亿铸科技's job postings over the past year, “计算机/网络/技术类”需求占52.2%,“电子/电器/通信技术类”占43.3%,“其他(研发和技术类)”占11.9%,“生物/制药/化工/环保类”占11.9%,“美术/设计/创意类”占1.5%. For reference only.

亿铸科技 — What Are the Salaries Like? (66 records)

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亿铸科技 Salary Overview
salary range: 3K - 50K, 84.9% of roles pay ¥20-50K
Note: salary statistics are based on 66 salary records from the past year and depend on the job sample. For reference only.
苏州亿铸智能科技有限公司工资待遇怎么样?亿铸科技84.9%的岗位拿20-50K,本科工资¥。苏州地区工资排名前5%,与同行业比+123%,计算机/网络/技术类平均工资¥39.3K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of 亿铸科技

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Are salaries high at 苏州亿铸智能科技有限公司? We provide: 开发工程师,验证工程师,编译器开发,设计工程师,架构师,测试工程,系统开发,编译器专家,芯片验证,dft,od,te,建模,芯片设计,软件测试,ic验证,oc,ps,ae,fa. Click to view detailed salary analysis by job.

亿铸科技 honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

亿铸科技 Related Industry Tags

Job Category

  • 计算机/网络/技术类
    51.5% of total 51.5%
  • 电子/电器/通信技术类
    43.9% of total 43.9%
  • 质量管理类
    13.6% of total 13.6%
  • 其他(研发和技术类)
    12.1% of total 12.1%

Education

  • 本科
    74.2% of total 74.2%
  • 硕士
    21.2% of total 21.2%
  • 不限
    4.5% of total 4.5%

Experience

  • 5-10年
    51.5% of total 51.5%
  • 不限
    33.3% of total 33.3%
  • 3-5年
    12.1% of total 12.1%
  • 1-3年
    3% of total 3%
View Detailed Analysis

What does 苏州亿铸智能科技有限公司 require? Who is 亿铸科技 hiring? 亿铸科技招聘类别计算机/网络/技术类占比最多占51.5%,其次是电子/电器/通信技术类占43.9%。亿铸科技什么学历能进?本科占比最多占74.2%,其次是硕士占21.2%。亿铸科技学历要求高吗?硕士占21.2%。工作经验亿铸科技有什么要求?5-10年占比最多占51.5%,其次是不限占33.3%。亿铸科技工作地区在哪?上海占比最多占57.6%,其次是苏州占36.4%。 Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 1,979.722万(元)
Legal Representative: DAPENG XIONG
Date Established:
Credit Code: 91310104MA1FRL3P0M
Registered Address: 苏州高新区塔园路101号佳兆业悦峰大厦1幢1911室

Partners & Suppliers

提供先进封装自动化测试设备 Source
合作客户 半导体
提供电机壳体自动化加工线 Source
合作客户 汽车
提供精密组装自动化解决方案 Source
合作客户 消费电子
提供晶圆自动化搬运系统及光刻机配套设备 Source
合作客户 半导体
提供发动机零部件自动化装配设备 Source
合作客户 汽车

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工厂 供应商 加工
动画 大学 体育教育 教学研究
“硅工艺微波集成电路专家”
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光电 玻璃基板 基板 液晶显示模组
网络 代理分销 视觉设计 研发

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