苏州亿铸智能科技有限公司 Reviews, Salaries and Jobs

Company Overview

Nature: 合资 Size: 100-499人 Founded: 6年
Industry: 电子技术/半导体/集成电路
Full name: 苏州亿铸智能科技有限公司。

Development Stage

Stage: A轮, 1亿人民币。
Ranking: Ranked #288 in Suzhou by popularity Ranked #3 in 苏州idm芯片公司 by popularity Ranked #6 in 苏州集成电路设计公司 by popularity Ranked #6 in 苏州电子工程公司 by popularity Ranked #7 in 苏州半导体设计公司 by popularity
Honors: 独角兽企业 According to algorithm
News: 2026-07-02：“亿铸科技”已完成10+亿元融资。
Salary: 83.9% of positions earn 30-50K以上, In 2026 vs last yeardecreased by 4%.。Master's salary: ¥46.2K.
R&D: "计算机/网络/技术类" demand: 42.7%, "电子/电器/通信技术类": 40.3%, "其他（研发和技术类）": 16.1%。
Recruiting: In 2026 vs 2025grew by 87%. Demand for highly educated talent: Master's: 17.
Requirement: Education: 本科 leads with 77.4%. Experience: 5-10年 leads with 53.2%.
Region: Distributed across 3 regions, 上海: 59.7%, 苏州: 31.5%, 杭州: 5.6%, 成都: 2.4%.

About the Company

亿铸科技成立于2020年6月，致力于用存算一体架构设计AI大算力芯片，将新型存储器ReRAM和存算一体架构相结合，通过全数字化的芯片设计思路，在当前产业格局的基础上，提供一条更具性价比、更高能效比、更大算力发展空间的AI大算力芯片换道发展新路径。

亿铸科技拥有非常优秀的研发、工程及顾问团队。研发能力覆盖了工艺器件、架构设计、电路设计和软件生态等全链条；工程团队核心成员平均拥有25年以上的高端集成电路设计和量产经验，有着丰富的应用和产品化实战经历。

Expand

Information is aggregated from the web and may not be exact. For reference only.

Information incorrect? Claim this company to edit

亿铸科技 News (1 items)

Manage

“亿铸科技”已完成10+亿元融资

From 36氪 2026-07-02 13:00:03

亿铸科技 Financing History (1 rounds)

Manage

A轮

Capital Market Favor

Latest Financing Round

Date: ?
Amount: 1亿人民币
Investor: 行至资本，Prosperi...

亿铸科技 How Fast Is Hiring Growing? (75 open positions)

Manage

Growth Rate

2026 vs 2025

2025: Down 25%
2024: Up 98%

亿铸科技 Year-by-Year Hiring:

2023 41 jobs 2024 81 jobs 2025 61 jobs 2026 114 jobs

Shanghai 45 Suzhou 22 Hangzhou 4 Chengdu 3 Beijing 1

亿铸科技 Campus Recruitment & Advanced Degree Talent Demand

Master's 17

No.665

Recruitment Growth Ranking in Suzhou 򀀩

亿铸科技 Latest Jobs

Note: How fast is hiring at 苏州亿铸智能科技有限公司 growing? 亿铸科技2026: 114 openings (up 87%), 2025: 61 openings (down 25%), 2024: 81 openings (up 98%), 2023: 41 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

亿铸科技 Master's Degree Job Demand Analysis

(More)

Growth Rate

2026 vs 2025

2025: Up 10%
2024: Up 122%

亿铸科技 Master's Hiring by Year:

2023 9 jobs 2024 20 jobs 2025 22 jobs 2026 ? *** 

* Hiring was generally low during 2020-2022 due to the pandemic

N/A

Master's Salary 򀀩

How fast is master's hiring at 苏州亿铸智能科技有限公司 growing? 亿铸科技Master's recruitment over the years: 2025: 22 openings (up 10%), 2024: 20 openings (up 122%), 2023: 9 openings.

亿铸科技 R&D Strength (Technical Talent Demand)

(More)

计算机/网络/技术类: 53 roles, 42.7% of total. Hot jobs:

How is the demand for technical talent at 苏州亿铸智能科技有限公司? Based on an analysis of 亿铸科技's job postings over the past year, "计算机/网络/技术类" demand: 42.7%, "电子/电器/通信技术类": 40.3%, "其他（研发和技术类）": 16.1%, "生物/制药/化工/环保类": 6.5%, "美术/设计/创意类": 1.6%. For reference only.

亿铸科技 — What Are the Salaries Like? (124 records)

Manage

亿铸科技 Salary Overview

￥30-50K以上

83.9% of roles pay

salary range: 3K - 50K, 83.9% of roles pay ￥30-50K以上

0.8% 3-4.5K 0.8% 8-10K 1.6% 15-20K 12.9% 20-30K ***  ? 30-50K ***  ? 50K以上

Note: salary statistics are based on 124 salary records from the past year and depend on the job sample. For reference only.

亿铸科技 Salary Ranking

By Category

计算机/网络/技术类￥40.4K  电子/电器/通信技术类  其他（研发和技术类）  质量管理类  翻译类 

How is the salary at 苏州亿铸智能科技有限公司?亿铸科技83.9% of positions earn 30-50K以上, Undergraduate salary: ¥。Suzhou salary ranking top 5，计算机/网络/技术类 average salary ¥40.4K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of 亿铸科技

(More)

Are salaries high at 苏州亿铸智能科技有限公司? We provide: 开发工程师，设计工程师，dft，架构师，od，验证工程师，编译器开发，芯片设计，测试工程，编译器专家，分析，培训，系统开发，芯片验证，oc，te，人才发展，建模，软件测试，bp. Click to view detailed salary analysis by job.

亿铸科技 honors, qualifications & industry associations

独角兽企业

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

亿铸科技 Related Industry Tags

Tags are auto-annotated by keyword text matching and may be correlated. For reference only.

Job Category

计算机/网络/技术类
42.7% of total 42.7%
电子/电器/通信技术类
40.3% of total 40.3%
其他（研发和技术类）
16.1% of total 16.1%
质量管理类
9.7% of total 9.7%

Job Location

Education

本科
77.4% of total 77.4%
硕士
21% of total 21%
不限
1.6% of total 1.6%

Experience

5-10年
53.2% of total 53.2%
3-5年
22.6% of total 22.6%
不限
21% of total 21%
1-3年
3.2% of total 3.2%

View Detailed Analysis

What does 苏州亿铸智能科技有限公司 require? Who is 亿铸科技 hiring? 亿铸科技 recruitment: 计算机/网络/技术类占比最多占42.7%，其次是电子/电器/通信技术类占40.3%. What education can get in at 亿铸科技? 本科占比最多占77.4%，其次是硕士占21%. High education required at 亿铸科技? 硕士占21%. Work experience required at 亿铸科技? 5-10年占比最多占53.2%，其次是3-5年占22.6%. Where are the job locations at 亿铸科技? 上海占比最多占59.7%，其次是苏州占31.5%. Based on job postings from the past year, for reference only.