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Company Overview

Development Stage

About the Company

UTAC联测优特半导体的集团总部位于新加坡,是全球半导体封装测试行业的优秀企业,在集成电路,模拟混合信号,逻辑无线电频率集成电路IC等相关业务,在全球范围内均占有其独立的一席之地。UTAC具有一流的半导体生产线和服务团队,在全球有12家生产工厂,并已在德国、新加坡、日本等地设有销售分公司,产品远销美洲、亚洲、欧洲等多个国家,主要客户包括国内外半导体及电子消费产品知名厂商。 公司一贯遵循“秉持具有创造力的员工与持续改善的文化,提供优良的产品与服务,以满足客户的期望”的品质政策,以“热忱的团队倾力提供客户出色的测试与封装完整解决方案”为愿景和“团结 信任 担当 沟通”的价值观,在“以人为本”的企业文化下,不断发展,以卓越的品质享誉全球。 UTAC上海工厂于2023年建成,致力于打造芯片先进封装的一流产线。

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Information is aggregated from the web and may not be exact. For reference only.
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How Fast Is Hiring Growing?

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Year-by-Year Hiring:
Note: How fast is hiring at 联测优特半导体(上海)有限公司 growing? 2025: 32 openings (up 14%), 2024: 28 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

— What Are the Salaries Like? (14 records)

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salary range: 3K - 20K, 71.5% of roles pay ¥6-15K
Note: salary statistics are based on 14 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 联测优特半导体(上海)有限公司?71.5% of positions earn 6-15K, Undergraduate salary: ¥。工厂生产类 average salary ¥9.9K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Related Industry Tags

Job Category

  • 工厂生产类
    57.1% of total 57.1%
  • 其他类
    21.4% of total 21.4%
  • 人力资源类
    14.3% of total 14.3%
  • 客户服务类
    14.3% of total 14.3%

Education

  • 大专
    50% of total 50%
  • 本科
    50% of total 50%

Experience

  • 不限
    100% of total 100%
View Detailed Analysis

What does 联测优特半导体(上海)有限公司 require? Who is 联测优特半导体(上海)有限公司 hiring? recruitment: 工厂生产类占比最多占57.1%,其次是其他类占21.4%. What education can get in at ? 大专占比最多占50%,其次是本科占50%. Work experience required at ? 不限占比最多占100%. Where are the job locations at ? 烟台占比最多占100%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 6,800万(美元)
Legal Representative: 肖辉
Date Established:
Credit Code: 91310000MA1JE6500P
Registered Address: 上海市金山工业区广业路585号1幢2层345室

Partners & Suppliers

提供封装设备及相关材料 Source
供应商 半导体封装测试服务
提供半导体测试设备及服务 Source
供应商 半导体封装测试服务
提供通信芯片封装测试服务 Source
合作客户 半导体封装测试服务
提供手机芯片等封装测试服务 Source
合作客户 半导体封装测试服务
提供芯片封装测试服务 Source
合作客户 半导体封装测试服务

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