山东芯通微电子科技有限公司,是一家专业从事FC BGA、WB BGA中高端芯片封装测试的高新技术企业,技术和产品方向是我国目前基本空白或市场占有率极低的高端先进技术和产品,
芯通微电子核心技术团队成员平均在封测业内具有10年以上从业经验,过往均就业于国内外知名封装测试企业,目前项目一期投资超两亿元,工厂面积超万平方米,2024年10月建成投产。
What does 山东芯通微电子科技有限公司 require? Who is 山东芯通微电子科技有限公司 hiring? recruitment: 工厂生产类占比最多占30.8%,其次是技工类占28.2%. What education can get in at ? 大专占比最多占56.4%,其次是本科占43.6%. Work experience required at ? 3-5年占比最多占43.6%,其次是不限占43.6%. Where are the job locations at ? 济南占比最多占100%. Based on job postings from the past year, for reference only.
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