辽宁汉京半导体材料有限公司 Reviews, Salaries and Jobs

Company Overview

Nature: 民营公司 Size: 500-999人 Founded: 4年
Industry: 电子技术/半导体/集成电路
Full name: 辽宁汉京半导体材料有限公司。

Development Stage

Stage: 并购。
Ranking: Ranked #48 in Shenyang by popularity Ranked #6 in 沈阳微电子公司 by popularity Ranked #8 in 沈阳半导体公司 by popularity Ranked #8 in 沈阳电子元件公司 by popularity Ranked #8 in 沈阳集成电路/IC公司 by popularity
Honors: 高新技术企业省级高新技术企业 According to algorithm
Salary: 77.1% of positions earn 3-6K, In 2026 vs last yearremained flat.。Master's salary: ¥9.0K.
Recruiting: In 2026 vs 2025decreased by 11%. Demand for highly educated talent: Master's: 1.
Requirement: Education: 高中 leads with 48.6%. Experience: 1-3年 leads with 48.6%.
Region: Distributed across 1 regions, 沈阳: 100%.

About the Company

辽宁汉京半导体材料有限公司（简称：汉京半导体），成立于2022年6月，是一家专业从事SiC（学名：碳化硅）烧结、CVD涂层、精加工生产、检验、销售为一体的高精端企业。公司经营范围：半导体产业用碳化硅、氮化硅、氧化铝等工业陶瓷产品及半导体和太阳能产业石英制品

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Information is aggregated from the web and may not be exact. For reference only.

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Financing History (2 rounds)

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并购

Capital Market Favor

Latest Financing Round

Date: ?
Amount: 融资金额未公开
Investor: 正帆科技

How Fast Is Hiring Growing? (13 open positions)

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Growth Rate

2026 vs 2025

2025: Up 443%

Year-by-Year Hiring:

2024 7 jobs 2025 38 jobs 2026 34 jobs

Shenyang 13

Campus Recruitment & Advanced Degree Talent Demand

Master's 1

Latest Jobs

Note: How fast is hiring at 辽宁汉京半导体材料有限公司 growing? 2026: 34 openings (down 11%), 2025: 38 openings (up 443%), 2024: 7 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

— What Are the Salaries Like? (35 records)

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Salary Overview

￥3-6K

77.1% of roles pay

salary range: 3K - 15K, 77.1% of roles pay ￥3-6K

***  ? 3-4.5K ***  ? 4.5-6K 17.1% 6-8K 2.9% 8-10K 2.9% 10-15K

Note: salary statistics are based on 35 salary records from the past year and depend on the job sample. For reference only.

Salary Ranking

By Category

技工类￥5.6K  工厂生产类  机械/仪器仪表类  电气/能源/动力类  质量管理类 

How is the salary at 辽宁汉京半导体材料有限公司?77.1% of positions earn 3-6K, Undergraduate salary: ¥。技工类 average salary ¥5.6K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of

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Are salaries high at 辽宁汉京半导体材料有限公司? We provide: cnc，数控，操作工，普工，检查员，qc，切割，生产计划，研发工程师，磨工，质检，pm，qa，人事，人资，仓库，加工中心，包装工，安全，工艺工程. Click to view detailed salary analysis by job.

honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

Related Industry Tags

Tags are auto-annotated by keyword text matching and may be correlated. For reference only.

Job Category

技工类
57.1% of total 57.1%
工厂生产类
25.7% of total 25.7%
机械/仪器仪表类
25.7% of total 25.7%
电气/能源/动力类
20% of total 20%

Job Location

沈阳
100% of total 100%

Education

高中
48.6% of total 48.6%
本科
28.6% of total 28.6%
大专
17.1% of total 17.1%
硕士
2.9% of total 2.9%

Experience

1-3年
48.6% of total 48.6%
不限
31.4% of total 31.4%
3-5年
14.3% of total 14.3%
5-10年
5.7% of total 5.7%

View Detailed Analysis

What does 辽宁汉京半导体材料有限公司 require? Who is 辽宁汉京半导体材料有限公司 hiring? recruitment: 技工类占比最多占57.1%，其次是工厂生产类占25.7%. What education can get in at ? 高中占比最多占48.6%，其次是本科占28.6%. High education required at ? 硕士占2.9%. Work experience required at ? 1-3年占比最多占48.6%，其次是不限占31.4%. Where are the job locations at ? 沈阳占比最多占100%. Based on job postings from the past year, for reference only.