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Beijing Haidian District No.12 高性能计算 No.26 封装 No.49 光学 No.87 处理器芯片 No.92 电子设备 No.94 集成电路/IC No.96 电子元件 No.99 存储产品 芯片 半导体 智能化 接口芯片 科技型中小企业 市科技型中小企业

光联芯科本科 salary overview

How is the salary and benefits at 北京光联芯科智能科技有限公司 本科? Are the salaries high at 光联芯科 本科?Salary range: ¥10K-50K, with 66.6% of positions earning 30-50K以上, 光联芯科本科电子/电器/通信技术类 positions lead with 63.6%%. 光联芯科本科北京 salary: ¥34.7K.
光联芯科本科 salary range: 10K - 50K, where 66.6% of positions earn ¥30-50K以上
6.1% 10-15K 9.1% 15-20K 18.2% 20-30K *** ? 30-50K *** ? 50K以上
Note: the salary statistics for 北京光联芯科智能科技有限公司本科 are based on 33 salary records from the past year. The data depends on the position samples and is for reference only.
￥30-50K以上
66.6% of positions earn
?
Average salary for this position

Note: the average salary is analyzed based on job postings published by the company. We recommend reviewing it together with position type, education, region and experience.

光联芯科本科 salary changes over the years

Note: the data depends on salary samples of online job postings in the corresponding years and does not fully represent the actual situation within the company. For reference only.

北京光联芯科智能科技有限公司本科Salary range: 10-15K: %, 15-20K: %, 20-30K: %. . Disclaimer: statistics are based on job posting analysis and do not represent the actual situation of current employees; system stability may affect objectivity, so please treat the data as reference only. Data inaccurate? Report it
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光联芯科本科 salary by department: 电子/电器/通信技术类 is the most common

Which departments does 北京光联芯科智能科技有限公司本科 have? For reference only.

Salaries for hot jobs of 光联芯科本科

Are salaries high at 北京光联芯科智能科技有限公司本科? We provide: 设计工程师, ea, cpo, 器件工程师, 测试工程, 硬件, 设备工, 软件工程. Click to view detailed salary analysis by job.

光联芯科 本科 salary by region: Beijing has the most openings

Note: which cities are 北京光联芯科智能科技有限公司 本科 positions distributed in? How are 光联芯科 本科 salaries in each region? For reference only.

光联芯科本科 salary list/ranking

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Note: 光联芯科 employee salarydata is collected from public salary information published on various websites by the company in the past year. For reference only.

Talent Demand Trend Analysis More

  • 接口芯片
  • 高性能计算
  • 先进封装
  • 封装
  • 处理器芯片
  • 电子元件
  • 智能化
  • 光学
  • 半导体
  • 芯片
  • 电子设备
  • 集成电路/IC
  • 存储产品

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