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Company Overview

Development Stage

About the Company

Information is aggregated from the web and may not be exact. For reference only.
Information incorrect? Claim this company to edit

Recruitment Overview / Current Status (2 open positions)

Manage
-84%
Growth Rate
2026 vs 2025
Year-by-Year Hiring: 2026 has 2025 fewer positions than 16
Campus Recruitment & Advanced Degree Talent Demand
Part-time 1
Note: How fast is hiring at 江苏亚泽半导体材料有限公司 growing? 2026: 3 openings, 2025: 19 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

— What Are the Salaries Like? (13 records)

Manage
salary range: 3K - 15K, 61.6% of roles pay ¥6-10K
Note: salary statistics are based on 13 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 江苏亚泽半导体材料有限公司?61.6% of positions earn 6-10K, Undergraduate salary: ¥。经营管理类 average salary ¥9.7K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

Related Industry Tags

Tags are auto-annotated by keyword text matching and may be correlated. For reference only.

Job Category

  • 经营管理类
    38.5% of total 38.5%
  • 质量管理类
    38.5% of total 38.5%
  • 技工类
    15.4% of total 15.4%
  • 行政/后勤类
    15.4% of total 15.4%

Education

  • 本科
    69.2% of total 69.2%
  • 高中
    23.1% of total 23.1%
  • 大专
    7.7% of total 7.7%

Experience

  • 不限
    100% of total 100%
View Detailed Analysis

What does 江苏亚泽半导体材料有限公司 require? Who is 江苏亚泽半导体材料有限公司 hiring? recruitment: 经营管理类占比最多占38.5%,其次是质量管理类占38.5%. What education can get in at ? 本科占比最多占69.2%,其次是高中占23.1%. Work experience required at ? 不限占比最多占100%. Where are the job locations at ? 无锡占比最多占100%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 1,000万(元)
Legal Representative: 黄丙峰
Date Established:
Credit Code: 91320214MAE071310W
Registered Address: 无锡市新吴区鸿山街道鸿运南路27号2号厂房

Partners & Suppliers

采购林德的高纯电子特气 Source
供应商 特种气体
采购住友化学的光刻胶产品 Source
供应商 光刻胶
采购信越化学生产的多晶硅或硅棒 Source
供应商 硅材料
供应半导体封装材料 Source
合作客户 封测
提供封装材料给通富微电 Source
合作客户 封测

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