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Company Overview

Development Stage

  • Salary: 85.4%的岗位拿6-10K,In 2026 vs last yea。.
  • Recruiting: In 2026 vs 2025
  • Region: Distributed across 1 regions.

About the Company

Information is aggregated from the web and may not be exact. For reference only.
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Recruitment Overview / Current Status (8 open positions)

Manage
Note: How fast is hiring at 西安谦和信息科技有限公司 growing? 2026年26个,2025年36个. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

— What Are the Salaries Like? (41 records)

Manage
salary range: 3K - 10K, 85.4% of roles pay ¥6-10K
Note: salary statistics are based on 41 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 西安谦和信息科技有限公司?85.4%的岗位拿6-10K,Compared with the industry-40%,客户服务类平均工资¥7.2K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of

(More)
Are salaries high at 西安谦和信息科技有限公司? We provide: 实习生,经理助理,人事,运营,前台,培训,管培生. Click to view detailed salary analysis by job.

Job Category

  • 客户服务类
    62.5% of total 62.5%
  • 在校学生类
    42.5% of total 42.5%
  • 技工类
    25% of total 25%
  • 人力资源类
    20% of total 20%

Education

  • 不限
    82.5% of total 82.5%
  • 高中
    15% of total 15%
  • 大专
    2.5% of total 2.5%

Experience

  • 不限
    100% of total 100%
View Detailed Analysis

What does 西安谦和信息科技有限公司 require? Who is 西安谦和信息科技有限公司 hiring? recruitment: 客户服务类占比最多占62.5%,其次是在校学生类占42.5%. What education can get in at ? 不限占比最多占82.5%,其次是高中占15%. Work experience required at ? 不限占比最多占100%. Where are the job locations at ? 西安占比最多占100%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 50万(元)
Legal Representative: 胡春芬
Date Established:
Credit Code: 91610104MAE0GKJX5H
Registered Address: 陕西省西安市莲湖区北关正街33号腾飞鸿翔大厦11801层1808室

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“公司以科技创新为先导,积极致力于集成电路高端封装技术的研发和CSP封装技术的开发。”
教育科技 教育信息化
系统集成 5G 信息安全 安全设备
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