Company Overview

Development Stage

About the Company

[Summary] 集成电路领域注入机供应商

北京烁科中科信电子装备有限公司成立于2019年6月,以中国电科48所和北京中科信离子注入机业务战略整合而成,是国内集成电路高端工艺装备的企业。公司总部位于北京市北京经济开发区(通州)兴光二街六号,在长沙设有分公司。烁科中科信产品聚焦集成电路主要应用领域,兼顾化合物半导体、材料加工制备等领域,形成中束流、大束流、高能机、特种、化合物半导体等系列化离子注入机产品体系。 烁科中科信目前累计获得授权专利87项,团队现有人员600余人,硕士以上学历占20%以上。公司是高新技术企业、第五批专精特新“小巨人”企业,“大束流离子注入机项目”获得“北京市科技进步一等奖”,大束流离子注入机入选《中央企业科技创新成果推荐目录(2022年版)》。2024年初,国产离子注入机代表中国电科成功进入“2023年度央企十大国之重器”榜单,综合排名第三位,公司也成功入选国资委首批启航企业。 北京烁科中科信电子装备有限公司是产品门类齐全的集研发、制造、服务于一体的集成电路领域离子注入机供应商。

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Information is aggregated from the web and may not be exact. For reference only.
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Financing History (3 rounds)

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B轮
Capital Market Favor
Latest Financing Round
  • Date: ?
  • Amount: 超7亿人民币
  • Investor: 中国国新控股

How Fast Is Hiring Growing? (110 open positions)

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Note: How fast is hiring at 北京中科信半导体股份有限公司 growing? 2026: 209 openings (up 127%), 2025: 92 openings (up 61%), 2024: 57 openings (up 418%), 2023: 11 openings (flat), 2022: 11 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

Master's Degree Job Demand Analysis

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?
Growth Rate
2026 vs 2025
  • 2025: Up 53%
  • 2024: Up 183%
  • 2023: Down 14%
Master's Hiring by Year:
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 北京中科信半导体股份有限公司 growing? Master's recruitment over the years: 2025: 26 openings (up 53%), 2024: 17 openings (up 183%), 2023: 6 openings (down 14%), 2022: 7 openings.

Doctoral Degree Job Demand Analysis

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Flat
Growth Rate
2026 vs 2025
Doctoral Hiring by Year: 2026 — same as 2025
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is doctoral hiring at 北京中科信半导体股份有限公司 growing? Doctorate recruitment over the years: 2026: 1 openings (up 123%), 2025: 1 openings (up 53%), 2023: 1 openings (down 14%), 2022: 1 openings.

R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 北京中科信半导体股份有限公司? Based on an analysis of 's job postings over the past year, "机械/仪器仪表类" demand: 34.8%, "电子/电器/通信技术类": 29.1%, "其他(研发和技术类)": 9.7%, "计算机/网络/技术类": 6.5%, "电气/能源/动力类": 4.9%, "生物/制药/化工/环保类": 2.4%. For reference only.

— What Are the Salaries Like? (247 records)

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salary range: 6K - 50K, 57.1% of roles pay ¥15-30K
Note: salary statistics are based on 247 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 北京中科信半导体股份有限公司?57.1% of positions earn 15-30K, Undergraduate salary: ¥。机械/仪器仪表类 average salary ¥23.4K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of

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Are salaries high at 北京中科信半导体股份有限公司? We provide: 设备工,工艺工程,质量,qe,fa,物料管理,设备经理,软件工程,qc,质检,售后,控制工程师,电气,销售,c语言,装配,设备主管,pm,仓储,仓库. Click to view detailed salary analysis by job.

honors, qualifications & industry associations

Job Category

  • 机械/仪器仪表类
    34.8% of total 34.8%
  • 电子/电器/通信技术类
    29.1% of total 29.1%
  • 工厂生产类
    26.7% of total 26.7%
  • 技工类
    22.7% of total 22.7%

Education

  • 本科
    68.8% of total 68.8%
  • 硕士
    27.1% of total 27.1%
  • 大专
    3.2% of total 3.2%
  • 博士
    0.8% of total 0.8%

Experience

  • 3-5年
    40.1% of total 40.1%
  • 不限
    26.7% of total 26.7%
  • 5-10年
    17% of total 17%
  • 1-3年
    16.2% of total 16.2%
View Detailed Analysis

What does 北京中科信半导体股份有限公司 require? Who is 北京中科信半导体股份有限公司 hiring? recruitment: 机械/仪器仪表类占比最多占34.8%,其次是电子/电器/通信技术类占29.1%. What education can get in at ? 本科占比最多占68.8%,其次是硕士占27.1%. High education required at ? 硕士占27.1%,博士占0.8%. Work experience required at ? 3-5年占比最多占40.1%,其次是不限占26.7%. Where are the job locations at ? 北京占比最多占56.7%,其次是上海占6.9%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 24,693.8634万(元)
Legal Representative: 王平
Date Established:
Credit Code: 91110112MA01KTDF11
Registered Address: 北京市北京经济技术开发区荣华中路19号院1号楼B座20层102-2002室

Partners & Suppliers

北方华创向北京中科信半导体股份有限公司提供半导体设备(如刻蚀、薄膜设备)。 Source
供应商 设备/材料
通富微电为北京中科信半导体股份有限公司提供先进封装服务。 Source
供应商 芯片封测
华虹半导体为北京中科信半导体股份有限公司提供特色工艺晶圆代工服务。 Source
供应商 晶圆代工
芯原股份为北京中科信半导体股份有限公司提供芯片设计IP和一站式设计服务。 Source
供应商 IP授权
华天科技为北京中科信半导体股份有限公司提供集成电路封装测试服务。 Source
供应商 芯片封测

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