funding history / development milestones

B轮，融资金额未公开

2025.12.15, 联道资产

A轮，1.36亿人民币

2023.01.01, 鹏鼎控股

Note: collected from public online reports, for reference only.

Talent Demand Trend Analysis More

半导体

电子设备

体育科技

电子元件

集成电路/IC

印刷电路板/PCB

电路板

计算机电路板

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