funding history / development milestones

B轮，融资金额未公开

2020.02.21, 毅达资本

Note: collected from public online reports, for reference only.

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集成电路/IC

微电子

半导体

电子材料

靶材

晶体管

合金丝

电子封装

封装材料

微电子封装

铜丝

封装

半导体封装

半导体材料

电子新材料

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