Comens New Materials

Beijing Comens New Materials Co., Ltd. (abbreviated as: Comens New Materials) was established in July 1999 with a registered capital of 431 million yuan. It is mainly engaged in the research, development, production and sales of composite adhesive materials, functional transportation materials, new energy materials, low-carbon coating materials, and optoelectronic display materials. Comens New Materials was listed on the ChiNext Board of the Shenzhen Stock Exchange in April 2011 (stock code: 300200). It currently owns four wholly-owned subsidiaries: Beijing Comens, Nantong Comens, Wuhan Huasen, and Qingyuan Better, as well as one controlling subsidiary, Jiangsu Ruipu. Comens New Materials has five R&D centers in Beijing, Shanghai, Nantong, Wuhan, and Guangzhou, four production bases in Beijing, Nantong, Wuhan, and Qingyuan, as well as a sales service network covering major cities across the country. The company has the right to foreign trade export, and its products are exported to more than 50 countries and regions. Comens New Materials is a leading enterprise in the domestic high-performance composite polyurethane adhesive industry and a user-preferred brand. Its wholly-owned subsidiary, Wuhan Huasen Plastic, is a professional manufacturer of sound insulation, vibration reduction, and noise reduction materials, and currently has the qualification of a first-tier supplier to more than 30 domestic automobile manufacturers. Another wholly-owned subsidiary, Qingyuan Better, is mainly engaged in the research, development, production and sales of insulating resins, electronic adhesives, and special coatings, and its technology in this field is at the leading level. Comens New Materials' products are widely used in emerging industries and important fields such as packaging, printing, transportation, safety protection, household appliances, building materials, new energy, power electronics, and optical electronic displays. The related products have successfully solved the problems of import substitution and key technology bottlenecks.