能讯半导体 funding history / development milestones

C轮,融资金额未公开

股权融资,融资金额未公开

股权融资,融资金额未公开

2019.11.01, 联景资产

股权融资,融资金额未公开

2019.06.01, 海通开元, 乔贝资本

Note: collected from public online reports, for reference only.

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能讯半导体 Competitors (Similar Companies)

“To become an internationally first-class integrated circuit manufactur”
“Semiconductor equipment and parts, electronic manufacturing equipment”
“Well-known semiconductor packaging and testing enterprise”
“High-tech enterprise specializing in the development of uncooled infra”
“A provider of video-centric intelligent IoT solutions and big data ser”
“我们一起创造We make it together ”
“Development and manufacturing of semiconductor materials, devices, and”
“Aiming to become an internationally top enterprise in the RF field, pr”
“光电器件及相关材料制造商”
“Research, design, and manufacturing of printed circuit boards”
“硅基太阳能专用肖特基芯片市场主要供应商”
“Dreams lead the future”
“综合通信解决方案提供商”
微电子 半导体 集成电路/IC 研发
半导体 芯片封装 半导体制造 图形处理器/GPU