Company Overview

Development Stage

About the Company

Carsem Semiconductor is a leading semiconductor packaging and testing supplier, established in 1972 and headquartered in Malaysia, providing a wide range of semiconductor packaging and testing services to global customers, and is recognized in the industry as the most experienced foundry. Our products are applied in communications, computers, consumer electronics, and automotive components. Our sales network covers Europe, America, and various parts of Asia.

The parent company of Carsem Semiconductor, Hong Leong Group Malaysia, is a highly successful conglomerate in Southeast Asia. With its operational base centered in Malaysia, it operates globally. Core businesses include manufacturing, financial services, insurance, asset operations, sales, and tourism.

Carsem Semiconductor (Suzhou) Co., Ltd. is a national high-tech certified enterprise. Located in Suzhou Industrial Park, Jiangsu Province, China, it covers an area of 16,000 square meters, with a total investment of US$120 million. Construction was completed in January 2004, and it officially commenced operations in September 2004. Our products are based on lead frame chips, manufactured with extremely high-end technology, leading the world in semiconductor packaging. Currently, we have obtained multiple certifications including ISO/TS 16949, SAC LEVEL 1, ISO-9001, and ISO-14001.

Carsem Suzhou is thriving, with over 1,800 employees. Continuously introducing new technologies, we will provide customers with top-tier technologies and solutions. Currently, the second-phase plant construction has been completed and is awaiting production. As an industry leader, we will provide more stable and safe job opportunities.

The company offers competitive salary and benefits, and comprehensive career planning. We look forward to outstanding talents joining our team to jointly build a corporate culture of "people-oriented, benefit-driven, and results-measured"!

Special Notice:
Our company strictly conducts recruitment in accordance with national laws, regulations, and relevant provisions. Job postings are published only on the addresses specified on our official website (our currently valid partner websites are Yuancai Network, 51job, Zhaopin, and Liepin). Any recruitment information published by other organizations or individuals without authorization under our company's name, or posted on other websites, is invalid. Applicants are advised to carefully verify and guard against fraud. We reserve the right to pursue legal liability for any infringement of our lawful rights.

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Information is aggregated from the web and may not be exact. For reference only.
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Carsem How Fast Is Hiring Growing? (62 open positions)

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Growth Rate
2026 vs 2025
  • 2025: Up 115%
  • 2024: Up 12%
  • 2023: Down 9%
  • 2022: Down 41%
Carsem Year-by-Year Hiring:
* Hiring was generally low during 2020-2022 due to the pandemic
Carsem Campus Recruitment & Advanced Degree Talent Demand
Master's 1
Note: How fast is hiring at Carsem Semiconductor (Suzhou) Co., Ltd. growing? Carsem2026: 136 openings (down 6%), 2025: 144 openings (up 115%), 2024: 67 openings (up 12%), 2023: 60 openings (down 9%), 2022: 66 openings (down 41%), 2021: 111 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

Carsem Master's Degree Job Demand Analysis

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-33%
Growth Rate
2026 vs 2025
Carsem Master's Hiring by Year: 2026 — 1 fewer jobs than 2025
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at Carsem Semiconductor (Suzhou) Co., Ltd. growing? CarsemMaster's recruitment over the years: 2026: 2 openings (down 6%), 2025: 3 openings (up 115%).

Carsem R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at Carsem Semiconductor (Suzhou) Co., Ltd.? Based on an analysis of Carsem's job postings over the past year, "电子/电器/通信技术类" demand: 22.6%, "其他(研发和技术类)": 8.5%, "机械/仪器仪表类": 8.5%, "生物/制药/化工/环保类": 4.7%, "电气/能源/动力类": 4.3%, "计算机/网络/技术类": 2.1%. For reference only.

Carsem — What Are the Salaries Like? (235 records)

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Carsem Salary Overview
salary range: 4.5K - 50K, 55.3% of roles pay ¥8-15K
Note: salary statistics are based on 235 salary records from the past year and depend on the job sample. For reference only.
How is the salary at Carsem Semiconductor (Suzhou) Co., Ltd.?Carsem55.3% of positions earn 8-15K, Undergraduate salary: ¥。工厂生产类 average salary ¥10.2K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of Carsem

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Are salaries high at Carsem Semiconductor (Suzhou) Co., Ltd.? We provide: 工艺工程,设备技术,sa,ee,工艺技术,pr,pe,分析,财务,ma,切割,oc,te,设备工,产品工程,电镀,项目管理,包装工,后道,ie. Click to view detailed salary analysis by job.

Carsem honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

Carsem Related Industry Tags

Job Category

  • 工厂生产类
    53.2% of total 53.2%
  • 技工类
    37% of total 37%
  • 电子/电器/通信技术类
    22.6% of total 22.6%
  • 质量管理类
    18.3% of total 18.3%

Education

  • 大专
    52.3% of total 52.3%
  • 本科
    38.3% of total 38.3%
  • 不限
    4.3% of total 4.3%
  • 高中
    3.4% of total 3.4%

Experience

  • 不限
    32.3% of total 32.3%
  • 1-3年
    31.1% of total 31.1%
  • 3-5年
    20.4% of total 20.4%
  • 5-10年
    16.2% of total 16.2%
View Detailed Analysis

What does Carsem Semiconductor (Suzhou) Co., Ltd. require? Who is Carsem hiring? Carsem recruitment: 工厂生产类占比最多占53.2%,其次是技工类占37%. What education can get in at Carsem? 大专占比最多占52.3%,其次是本科占38.3%. High education required at Carsem? 硕士占1.7%. Work experience required at Carsem? 不限占比最多占32.3%,其次是1-3年占31.1%. Where are the job locations at Carsem? 苏州占比最多占100%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 4,175万(美元)
Legal Representative: Manuel Zarauza Brandulas
Date Established:
Credit Code: 91320594735739957U
Registered Address: 苏州工业园区西沈浒路88号

Partners & Suppliers

提供晶圆测试服务 Source
合作客户 封装测试
嘉盛半导体采购日立化成的封装材料 Source
供应商 封装材料
嘉盛半导体采购信越化学的环氧模塑料等材料 Source
供应商 封装材料
嘉盛半导体采购昭和电工的封装材料 Source
供应商 封装材料
嘉盛半导体采购住友化学的引线框架等材料 Source
供应商 封装材料

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半导体 硬件 芯片设计 集成电路设计
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“专注于向电网企业和企业用户提供能源综合服务及解决方案”
工厂自动化设备 智慧工厂 自动化 汽车零部件/配件
驱动电机 新材料 有机硅 线束
“动力锂离子电池专业生产公司”
包装材料 薄膜 保护膜 CPE
芯片 芯片封装 驱动芯片 光电
光电 LED照明 智能照明 LED灯
机电 微型泵 生产 研发
电子厂/电子 光电 连接器 塑料件
“从事微电脑控制器及智能网络家电的集研发、生产、销售、服务于一体的高新技术企业”

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