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About the Company

[Summary] 高速低功耗混合信号芯片和IP解决方案提供商

龙迅半导体(合肥)股份有限公司(科创板股票代码688486)成立于2006年11月,是一家专注于高速信号传输、视频处理和新型显示驱动芯片的集成电路设计企业,产品广泛应用于消费电子、VR/AR、安防监控、5G通讯、汽车电子、工业控制等领域,拥有全球知名厂商在内的海内外客户1000多家。公司总部位于安徽合肥,在深圳设有全资子公司,销售代表处遍及欧、美、日、韩和中国台湾地区。
公司现有芯片设计研发团队近200人,由博士领衔,涵盖了丰富经验的系统架构师、电路设计工程师和嵌入式软硬件开发工程师等专业集成电路人员;建有安徽省企业技术中心、安徽省工程研究中心等多个省市级创新平台;已累计拥有各类知识产权300余项,中外发明专利近150项,多项技术填补国内空缺、达到国际先进水平,被评为“国家知识产权优势企业”。
在未来3-5年,公司将继续增加研发投入,加大国际化布局和市场开拓力度,努力成为国际一流的创新型集成电路设计企业。欢迎才华横溢的优秀学子带着梦想和微笑来龙迅撸起袖子、挥洒汗水,成就奇迹!

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龙迅股份 Financing History (3 rounds)

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IPO上市
Capital Market Favor
Latest Financing Round
  • Date: ?
  • Market:
  • Deal: 上交所

龙迅股份 How Fast Is Hiring Growing? (43 open positions)

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Note: How fast is hiring at 龙迅半导体(合肥)股份有限公司 growing? 龙迅股份2025年57个(下降37%),2024年91个(增长30%),2023年70个(增长71%),2022年41个(下降41%),2021年70个. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

龙迅股份 Master's Degree Job Demand Analysis

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Growth Rate
2026 vs 2025
  • 2025: Up 33%
  • 2024: Up 62%
  • 2023: Up 1200%
  • 2022: Down 67%
龙迅股份 Master's Hiring by Year:
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 龙迅半导体(合肥)股份有限公司 growing? 龙迅股份硕士 recruitment over the years: 2025年28个(增长33%),2024年21个(增长62%),2023年13个(增长1200%),2022年1个(下降67%),2021年3个. 龙迅股份 master talent ranking in 合肥: #39, 龙迅股份 master salary mostly around 30-50K以上.

龙迅股份 R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 龙迅半导体(合肥)股份有限公司? Based on an analysis of 龙迅股份's job postings over the past year, , , , , . For reference only.

龙迅股份 — What Are the Salaries Like? (87 records)

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salary range: 4.5K - 50K, 79.3% of roles pay ¥15-50K
Note: salary statistics are based on 87 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 龙迅半导体(合肥)股份有限公司?龙迅股份79.3%的岗位拿15-50K,应届生 salary: ¥15.0K。合肥 salary rankingtop 5%,Compared with the industry+109%,其他(研发和技术类)平均工资¥36.0K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of 龙迅股份

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Are salaries high at 龙迅半导体(合肥)股份有限公司? We provide: 设计工程师,ip设计,ae,fa,验证工程师,开发工程师,软件工程,cad,ic设计,前端,嵌入式,应用工程师,软件开发,后端,架构工程师,架构师,算法,采购,ic验证,td. Click to view detailed salary analysis by job.

龙迅股份 honors, qualifications & industry associations

龙迅股份 Related Industry Tags

Job Category

  • 其他(研发和技术类)
    43.8% of total 43.8%
  • 计算机/网络/技术类
    43.8% of total 43.8%
  • 电子/电器/通信技术类
    42.7% of total 42.7%
  • 美术/设计/创意类
    18% of total 18%

Education

  • 硕士
    51.7% of total 51.7%
  • 本科
    46.1% of total 46.1%
  • 高中
    1.1% of total 1.1%
  • 不限
    1.1% of total 1.1%

Experience

  • 不限
    57.3% of total 57.3%
  • 3-5年
    15.7% of total 15.7%
  • 1-3年
    12.4% of total 12.4%
  • 5-10年
    12.4% of total 12.4%
View Detailed Analysis

What does 龙迅半导体(合肥)股份有限公司 require? Who is 龙迅股份 hiring? 龙迅股份 recruitment: 其他(研发和技术类)占比最多占43.8%,其次是计算机/网络/技术类占43.8%. What education can get in at 龙迅股份? 硕士占比最多占51.7%,其次是本科占46.1%. High education required at 龙迅股份? 硕士占51.7%. Work experience required at 龙迅股份? 不限占比最多占57.3%,其次是3-5年占15.7%. Where are the job locations at 龙迅股份? 合肥占比最多占91%,其次是深圳占9%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 13,332.7968万(元)
Legal Representative: 陈峰
Date Established:
Credit Code: 913400007950924118
Registered Address: 安徽省合肥市经济技术开发区宿松路3963号智能装备科技园B3栋

Partners & Suppliers

日月光为龙迅半导体提供封装测试服务 Source
供应商 芯片封测
通富微电为龙迅半导体提供封装测试服务 Source
供应商 芯片封测
长电科技为龙迅半导体提供封装测试服务 Source
供应商 芯片封测
联华电子为龙迅半导体提供晶圆代工服务 Source
供应商 晶圆代工
台积电为龙迅半导体提供晶圆代工服务 Source
供应商 晶圆代工

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