Company Overview

Development Stage

About the Company

郑州合晶硅材料有限公司隶属于合晶集团,合晶集团有台湾母公司及上海合晶,上海晶盟,郑州合晶等多家子公司,属于全球第六大半导体硅片供应商,全球第三大低阻重掺硅片供应商,是全国知名半导体硅晶圆材料供应商。致力于产业发展和技术进步,通过自主创新创建了八寸单晶硅抛光片智能车间。企业立于“豫州之腹地、天下之*中”的河南,位于素有“空中丝绸之路”的郑州航空港经济综合实验区,交通便利,工业环境发展良好。作为河南省大尺寸硅晶圆抛光片制造商,同时也是省内*早投入运营的半导体级单晶硅抛光片的生产项目。致力于200mm硅单晶抛光片的量产和300mm硅单晶抛光片的研发实验。公司占地面积150余亩,拥有员工400余人,公司拥有国际先进的生产设备和配置,MES、EAP、SPC、FDC、EDI、CFM、自动搬运系统、自动仓储系统等先进生产管理系统,通过智能化设备的互联互通,实现生产、监控、调度的智能化、高效化运行。智能车间数控化率93%,产品一致性94%以上。致力于产业装备技术提升,为行业智能制造发展提供了强有力的支撑,有利推动了半导体产业核心材料的国产化进程。公司拥有经验丰富的研发团队,建立了产学研结合的高效研发流程,能够快速响应下游市场需求,经过多年的技术创新和积累,公司已提交申请12件发明专利,66 件实用新型专利及3件软著专利,其中4件发明专利、48件实用新型专利和3 件软著专利已获得授权。公司注重员工培养,团队建设,展现优秀的团队实力、创新的团队意识和团结的团队精神,为员工提供人性化管理、搭建成长平台,和人文关怀,致力员工和公司同成长、共发展。国家的战略扶持、政府的优惠政策、郑州合晶自强不息、创新创进的精神,一家以客为本的半导体材料供应商,正在冉冉升起、茁壮成长。

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How Fast Is Hiring Growing? (37 open positions)

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Note: How fast is hiring at 郑州合晶硅材料有限公司 growing? 2026: 71 openings (up 1%), 2025: 70 openings (up 289%), 2024: 18 openings (flat), 2023: 18 openings (down 5%), 2022: 19 openings (down 39%), 2021: 31 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 郑州合晶硅材料有限公司? Based on an analysis of 's job postings over the past year, "机械/仪器仪表类" demand: 20.2%, "电气/能源/动力类": 20.2%, "电子/电器/通信技术类": 9.6%, "计算机/网络/技术类": 7.7%, "其他(研发和技术类)": 6.7%, "生物/制药/化工/环保类": 4.8%. For reference only.

— What Are the Salaries Like? (104 records)

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salary range: 4.5K - 30K, 77.9% of roles pay ¥6-10K
Note: salary statistics are based on 104 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 郑州合晶硅材料有限公司?77.9% of positions earn 6-10K, Undergraduate salary: ¥。技工类 average salary ¥8.4K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of

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Are salaries high at 郑州合晶硅材料有限公司? We provide: 设备工,管理师,制程工程师,助理工程,工艺工程,弱电,电工,自动化,采购,cs,制程工艺,厂务,水工,物控,算法,系统工程师,pe,作业员,关务,化学. Click to view detailed salary analysis by job.

honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

Job Category

  • 技工类
    37.5% of total 37.5%
  • 工厂生产类
    20.2% of total 20.2%
  • 机械/仪器仪表类
    20.2% of total 20.2%
  • 电气/能源/动力类
    20.2% of total 20.2%

Education

  • 本科
    65.4% of total 65.4%
  • 大专
    33.7% of total 33.7%
  • 高中
    1% of total 1%

Experience

  • 3-5年
    51% of total 51%
  • 1-3年
    28.8% of total 28.8%
  • 不限
    11.5% of total 11.5%
  • 5-10年
    8.7% of total 8.7%
View Detailed Analysis

What does 郑州合晶硅材料有限公司 require? Who is 郑州合晶硅材料有限公司 hiring? recruitment: 技工类占比最多占37.5%,其次是工厂生产类占20.2%. What education can get in at ? 本科占比最多占65.4%,其次是大专占33.7%. Work experience required at ? 3-5年占比最多占51%,其次是1-3年占28.8%. Where are the job locations at ? 郑州占比最多占100%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 212,000万(元)
Legal Representative: 钟佑生
Date Established:
Credit Code: 91410100MA40K7H35C
Registered Address: 郑州航空港经济综合实验区规划工业四路以南、华夏大道以西

Partners & Suppliers

向中芯国际供应8英寸及12英寸硅片,作为其核心硅片供应商之一 Source
合作客户 芯片代工
与郑州大学材料科学与工程学院开展硅片制备技术联合研发及人才培养合作 Source
供应商 高校/研究院合作
向其采购清洗设备及工艺解决方案 Source
供应商 半导体设备
向其采购半导体级多晶硅,保障原材料供应 Source
供应商 多晶硅原材料
向其采购高纯度多晶硅,用于硅片拉晶工序 Source
供应商 多晶硅原材料

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