厦门士兰明镓化合物半导体有限公司 R&D strength - Jobui

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士兰明镓 R&D strength (tech talent demand and pay)

What is the demand for tech talent at 士兰明镓? Based on job postings in the past year, “机械/仪器仪表类”占18.4%，“电子/电器/通信技术类”占15.8%，“其他（研发和技术类）”占11.8%，“电气/能源/动力类”占6.6%，“生物/制药/化工/环保类”占5.3%，“计算机/网络/技术类”占3.9%. For reference only.

工厂生产类 salary: 50% of positions pay ¥8-15K/month

5.6% 4.5-6K 16.7% 6-8K 22.2% 8-10K 27.8% 10-15K 22.2% 15-20K 5.6% 20-30K

工厂生产类 talent demand: 18 positions, 23.7%, hot jobs:

Master's degree job demand analysis at 士兰明镓 (More)

N/A

Growth rate

士兰明镓 master's hiring over the years: 2025

2021 5 positions 2022 3 positions 2023 1 positions 2025 2 positions

* Hiring volume was generally low in 2020-2022 due to the pandemic

Master's salary 򀀩

士兰明镓 honors, qualifications & industry associations

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Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

Talent Demand Trend Analysis More

半导体

光电子器件

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化合物半导体

微电子

光电

LED芯片

功率半导体

半导体设计

二极管

晶圆

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