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About the Company

[Summary] 卫星通信设备服务商

北京融为科技有限公司坐落于*经济技术开发区——北京亦庄经济技术开发区,主要从事高速数传接收设备、卫星测控设备、弹箭地面遥测设备、便携式卫星地面终端设备、无人机数据链设备,以及高可靠硬件平台和板卡的研发和生产。
公司核心人员均来自于清华大学及华为,平均从业时间超过十年,参与过多个国家预研项目研发及重点型号的研制、交付、任务执行工作,具有丰富的设备研制经验,所开发的产品具有完整的自主知识产权,核心算法,程序,硬件平台,结构等均为自研,目前已完成接近三十多项软件著作权申报。
北京融为科技有限公司生产的超高速数字调制解调器已在国内多家单位广泛使用(包括中科院空天信息创新研究院等)。

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融为科技 Financing History (3 rounds)

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B轮
Capital Market Favor
Latest Financing Round
  • Date: ?
  • Amount: 融资金额未公开
  • Investor: 北京市先进制造和智能装备产...

融为科技 How Fast Is Hiring Growing? (10 open positions)

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?
Growth Rate
2026 vs 2025
  • 2025: Up 2%
  • 2024: Up 51%
  • 2023: Down 8%
  • 2022: Up 280%
融为科技 Year-by-Year Hiring:
* Hiring was generally low during 2020-2022 due to the pandemic
融为科技 Campus Recruitment & Advanced Degree Talent Demand
Master's 2
Note: How fast is hiring at 北京融为科技有限公司 growing? 融为科技2025年54个(增长2%),2024年53个(增长51%),2023年35个(下降8%),2022年38个(增长280%),2021年10个. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

融为科技 Master's Degree Job Demand Analysis

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?
Growth Rate
2026 vs 2025
  • 2025: Down 48%
  • 2024: Up 109%
  • 2023: Up 175%
融为科技 Master's Hiring by Year:
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 北京融为科技有限公司 growing? 融为科技历年硕士招聘职位量:2025年12个(下降48%),2024年23个(增长109%),2023年11个(增长175%),2022年4个.

融为科技 R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 北京融为科技有限公司? Based on an analysis of 融为科技's job postings over the past year, “电子/电器/通信技术类”需求占35.6%,“其他(研发和技术类)”占26.7%,“计算机/网络/技术类”占26.7%,“电气/能源/动力类”占6.7%,“机械/仪器仪表类”占2.2%. For reference only.

融为科技 — What Are the Salaries Like? (45 records)

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融为科技 Salary Overview
salary range: 6K - 50K, 71.2% of roles pay ¥10-30K
Note: salary statistics are based on 45 salary records from the past year and depend on the job sample. For reference only.
北京融为科技有限公司工资待遇怎么样?融为科技71.2%的岗位拿10-30K,本科工资¥。与同行业比+8%,电子/电器/通信技术类平均工资¥28.8K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of 融为科技

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Are salaries high at 北京融为科技有限公司? We provide: 设计工程师,fpga,c++,工艺工程,开发工程师,电装,人事,光学设计,嵌入式,招聘经理,硬件,行政,软件工程,软件设计,pcb工程师,人力,供应商开发,商务助理,安全,射频工程师. Click to view detailed salary analysis by job.

融为科技 honors, qualifications & industry associations

融为科技 Related Industry Tags

Tags are auto-annotated by keyword text matching and may be correlated. For reference only.

Job Category

  • 电子/电器/通信技术类
    35.6% of total 35.6%
  • 其他(研发和技术类)
    26.7% of total 26.7%
  • 计算机/网络/技术类
    26.7% of total 26.7%
  • 技工类
    13.3% of total 13.3%

Education

  • 本科
    66.7% of total 66.7%
  • 硕士
    20% of total 20%
  • 大专
    13.3% of total 13.3%

Experience

  • 3-5年
    48.9% of total 48.9%
  • 1-3年
    26.7% of total 26.7%
  • 5-10年
    22.2% of total 22.2%
  • 不限
    2.2% of total 2.2%
View Detailed Analysis

What does 北京融为科技有限公司 require? Who is 融为科技 hiring? 融为科技招聘类别电子/电器/通信技术类占比最多占35.6%,其次是其他(研发和技术类)占26.7%。融为科技什么学历能进?本科占比最多占66.7%,其次是硕士占20%。融为科技学历要求高吗?硕士占20%。工作经验融为科技有什么要求?3-5年占比最多占48.9%,其次是1-3年占26.7%。融为科技工作地区在哪?北京占比最多占48.9%,其次是上海占24.4%。 Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 1,222.13万(元)
Legal Representative: 郑雪峰
Date Established:
Credit Code: 91110105MA01CK2X01
Registered Address: 北京市北京经济技术开发区荣华南路15号院4号楼15层1501室(北京自贸试验区高端产业片区亦庄组团)

Partners & Suppliers

为天启星座物联网卫星项目提供地面终端设备 Source
合作客户 卫星物联网

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