About the Company

涌淳半导体(无锡)有限公司于2020年12月设立,注册资本人民币2000万。 涌淳半导体致力于半导体设备的研发和国产化,也是国内*主要的半导体设备再制造厂商之一。 涌淳半导体专注于半导体工艺设备的研发、制造、销售及售后一体化服务,提供半导体厂商工艺设备的一站式解决方案。经过团队共同的努力,涌淳已经是国内*主要的半导体设备再制造厂商之一,尤其在量测设备领域市场占有率更是领头羊。 涌淳半导体在半导体设备领域有广泛的客户基础,主要客户聚焦于国内一线晶圆厂和大型终端半导体厂商。 涌淳的服务涵盖机台设备的销售、安装、软硬件支持及性能提升、制程开发与良率提升、移机、保养服务、零件支持及教育训练等。

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Operating Status: 开业
Registered Capital: 2,000万(元)
Legal Representative: 李峰
Date Established:
Credit Code: 91320214MA24ME9850
Registered Address: 无锡市新吴区城南路228号306室

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