Company Overview

Development Stage

About the Company

锐杰微科技集团是一家专业从事集成电路封装加工制造的服务商,提供集成电路封装设计、仿真、封装工艺开发、快速打样、批量生产等服务,同时提供系统级封装所需元器件物料采购、专用存储KGD晶圆采购、陶瓷管壳定制与采购等配套服务。公司的目标规划为“在未来三至五年内成为国内先进的、大规模的专业集成电路封测企业”。现下设子公司芯锐科技、锐杰微(郑州),即将开设上海、南京分部。
锐杰微目前已通过了ISO9001质量管理体系认证;同时公司聘请了多位有丰富经验及成功案例的博士及专家,拥有*的封装设计、仿真团队及专业的封装加工制造团队、成品测试及考核验收技术团队;拥有一套完整的封装设计标准、生产管控流程;配备了先进的加工及测试工艺设备,在设计、生产、管理等方面有着丰富经验及成功案例。锐杰微的产品涵盖了民用、及各种专用专业领域产品,类型包括FBGA、FBGA SiP、Micro SD(TF)、QFN、DFN和UDP等。目前公司已成功完成多项高精尖项目量产任务,具有5层堆叠芯片加工能力,产品通过了工业级验收考核。
锐杰微目前的客户群体主要为各类研究所及高校,目前已与近30多家行业内*企业进行了深度合作,每年承接各类项目达到70多项,出货量达到数百万颗。锐杰微科技定位于充分发挥技术优势、高效整合业内资源,更好的服务客户需求,为客户提供从封装设计规划到成功产品的整套服务。
锐杰微(成都)设计及职能团队办公室位于高新区东方希望天祥广场,成都工厂位于双流区感知物联网产业园区内,毗邻电子产业园区,交通四通八达,厂房占地面积1268㎡;锐杰微郑州工厂位于新郑智能终端产业港7号楼,具有优越的环境及产业链优势,为国内多家高性能集成电路设计单位的定点封装加工企业。
锐杰微将一直秉承“品质为本,攻坚克难,勇于创新”的理念,为客户提供高品质的产品与服务。致力于满足客户及市场的各类需求。

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锐杰微 Financing History (2 rounds)

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B+轮
Capital Market Favor
Latest Financing Round
  • Date: ?
  • Amount: 融资金额未公开
  • Investor: 中益仁投资

锐杰微 How Fast Is Hiring Growing? (23 open positions)

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?
Growth Rate
2026 vs 2025
  • 2025: Up 76%
  • 2024: Up 467%
  • 2023: Down 18%
  • 2022: Up 57%
锐杰微 Year-by-Year Hiring:
* Hiring was generally low during 2020-2022 due to the pandemic
Note: How fast is hiring at 苏州锐杰微科技集团有限公司 growing? 锐杰微2026: 48 openings (down 47%), 2025: 90 openings (up 76%), 2024: 51 openings (up 467%), 2023: 9 openings (down 18%), 2022: 11 openings (up 57%), 2021: 7 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

锐杰微 R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 苏州锐杰微科技集团有限公司? Based on an analysis of 锐杰微's job postings over the past year, "电子/电器/通信技术类" demand: 25.6%, "其他(研发和技术类)": 17.9%, "机械/仪器仪表类": 11.5%, "美术/设计/创意类": 9%, "计算机/网络/技术类": 9%, "电气/能源/动力类": 2.6%. For reference only.

锐杰微 — What Are the Salaries Like? (78 records)

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锐杰微 Salary Overview
salary range: 4.5K - 20K, 87.2% of roles pay ¥8-15K
Note: salary statistics are based on 78 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 苏州锐杰微科技集团有限公司?锐杰微87.2% of positions earn 8-15K, Undergraduate salary: ¥。工厂生产类 average salary ¥12.4K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of 锐杰微

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Are salaries high at 苏州锐杰微科技集团有限公司? We provide: 工艺工程,设计工程师,pm,项目工程,bm,生产技术,aoi,会计,设备工,采购,ea,mes,pc工程师,切割,系统工程师,计划工程师,财务,fa,ma,pi. Click to view detailed salary analysis by job.

锐杰微 honors, qualifications & industry associations

锐杰微 Related Industry Tags

Job Category

  • 工厂生产类
    44.9% of total 44.9%
  • 技工类
    37.2% of total 37.2%
  • 电子/电器/通信技术类
    25.6% of total 25.6%
  • 其他(研发和技术类)
    17.9% of total 17.9%

Education

  • 大专
    50% of total 50%
  • 本科
    41% of total 41%
  • 高中
    9% of total 9%

Experience

  • 不限
    76.9% of total 76.9%
  • 3-5年
    14.1% of total 14.1%
  • 1-3年
    5.1% of total 5.1%
  • 5-10年
    3.8% of total 3.8%
View Detailed Analysis

What does 苏州锐杰微科技集团有限公司 require? Who is 锐杰微 hiring? 锐杰微 recruitment: 工厂生产类占比最多占44.9%,其次是技工类占37.2%. What education can get in at 锐杰微? 大专占比最多占50%,其次是本科占41%. Work experience required at 锐杰微? 不限占比最多占76.9%,其次是3-5年占14.1%. Where are the job locations at 锐杰微? 苏州占比最多占60.3%,其次是郑州占11.5%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 1,894.7765万(元)
Legal Representative: 方家恩
Date Established:
Credit Code: 91510122MA61WE8U85
Registered Address: 苏州高新区金山东路78号1幢Z101室

Partners & Suppliers

为华为海思提供芯片封装与测试服务 Source
合作客户 集成电路封装测试
为地平线提供AI芯片封装与测试服务 Source
合作客户 集成电路封装测试
为北京君正提供芯片封装与测试服务 Source
合作客户 集成电路封装测试
为博通集成提供无线通信芯片封装与测试服务 Source
合作客户 集成电路封装测试
为恒玄科技提供智能音频SoC封装与测试服务 Source
合作客户 集成电路封装测试

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软性电路板 电路板 基板 封装基板
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模具制造 铝合金 压铸 铝合金制品

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