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Company Overview

Development Stage

About the Company

"日月新集团主要从事半导体元器件的封装测试业务。作为全球半导体封测知名企业,日月新集团为全球客户提供封装设计、前段工程测试、晶圆针测、后段半导体封装、成品测试的专业一元化服务,并且拥有集技术研发为一体的检测中心,以*先进设备和丰富的半导体封装测试经验,为客户提供完善的电子制造服务的整体解决方案。
日荣半导体(上海)有限公司位于上海浦东张江,投资数亿美元,拥有一个完整的封装设计、组装、测试厂区,并结合现有芯片制造商及IC设计公司,为客户提供一站式全方位产品及服务。
公司一直致力于为员工提供广阔的快速成长的平台与机会,为员工实现人生价值和施展个人才华创造更加多元化的规划和舞台。提供新人训/TWI训练/部门OJT与认证/跨部门项目等内外部专业培训。使关键人才得以朝公司策略性目标精进

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Information is aggregated from the web and may not be exact. For reference only.
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How Fast Is Hiring Growing? (19 open positions)

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Note: How fast is hiring at 日荣半导体(上海)有限公司 growing? 2025年37个(增长19%),2024年31个(下降39%),2023年51个(下降9%),2022年56个. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

— What Are the Salaries Like? (40 records)

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salary range: 6K - 50K, 95% of roles pay ¥6-20K
Note: salary statistics are based on 40 salary records from the past year and depend on the job sample. For reference only.
日荣半导体(上海)有限公司工资待遇怎么样?95%的岗位拿6-20K,本科工资¥。与同行业比-43%,技工类平均工资¥13.6K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of

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Are salaries high at 日荣半导体(上海)有限公司? We provide: 工艺工程,主任工程师,普工,电镀,设备主任,设备工,sa,专案工程师,产品测试,测试工程,生产员,设计工程师,销售,ba,bm,gs,md,pe,pi,qc. Click to view detailed salary analysis by job.

honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

Job Category

  • 技工类
    43.9% of total 43.9%
  • 工厂生产类
    31.7% of total 31.7%
  • 在校学生类
    19.5% of total 19.5%
  • 其他(研发和技术类)
    17.1% of total 17.1%

Education

  • 本科
    61% of total 61%
  • 大专
    19.5% of total 19.5%
  • 不限
    9.8% of total 9.8%
  • 高中
    7.3% of total 7.3%

Experience

  • 不限
    78% of total 78%
  • 1-3年
    14.6% of total 14.6%
  • 5-10年
    7.3% of total 7.3%
View Detailed Analysis

What does 日荣半导体(上海)有限公司 require? Who is 日荣半导体(上海)有限公司 hiring? 招聘类别技工类占比最多占43.9%,其次是工厂生产类占31.7%。什么学历能进?本科占比最多占61%,其次是大专占19.5%。工作经验有什么要求?不限占比最多占78%,其次是1-3年占14.6%。工作地区在哪?上海占比最多占92.7%,其次是苏州占7.3%。 Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 70,555万(元)
Legal Representative: 赵健
Date Established:
Credit Code: 91310115MA1K4K2B6L
Registered Address: 中国(上海)自由贸易试验区郭守敬路669号

Partners & Suppliers

提供化学机械抛光(CMP)设备用于封装 Source
供应商 半导体设备
提供电镀、清洗设备 Source
供应商 半导体设备
提供涂胶显影、刻蚀设备 Source
供应商 半导体设备
为赛灵思提供FPGA封装测试服务 Source
合作客户 芯片设计
为瑞昱提供音频、网络芯片封装测试 Source
合作客户 芯片设计

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Competitors (Similar Companies)

“成为优质、创新、值得信赖的国际一流集成电路制造企业”
“半导体芯片研发商”
电子厂/电子 芯片封装 半导体 功率器件
“为全球半导体客户提供全方位的基板设计与制造服务的基板制造服务领导厂商”
“电子产品大型设计制造服务商”
“半导体封测知名企业”
LCD 芯片 芯片封装 驱动芯片
“印制电路板的研发、生产和销售”
“专注于8英寸特色工艺平台的研发和拓展,成为设计企业可信赖的芯片制造伙伴”
“半导体封装测试生产厂家之一”
芯片制造 集成电路制造 闪存 存储器
“环电为全球DMS(ODM/EMS)领导厂商”
“产品为12英寸集成电路晶圆,应用于PC,Server,Graphic,Mobile,Graphic等”
“主要进行半导体产品的研究、开发、封装、测试及生产,并提供相应的售后服务”
“主要从事半导体专用设备的研发、生产和销售。”

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