Company Overview

Development Stage

About the Company

北京华封集芯电子有限公司于2021年4月被北京市北京经济技术开发区引进并建设,注册资本240000万元。结合当前国内集成电路产业蓬勃发展及面临的国际竞争的大形势,响应国家产业自主可控、北京市产业升级及开发区大力发展集成电路全产业链的政策要求,积极开展的先进封测项目。

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Information is aggregated from the web and may not be exact. For reference only.
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How Fast Is Hiring Growing? (121 open positions)

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Note: How fast is hiring at 北京华封集芯电子有限公司 growing? 2026: 303 openings (up 472%), 2025: 53 openings (up 130%), 2024: 23 openings (up 130%), 2023: 10 openings (up 67%), 2022: 6 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

Master's Degree Job Demand Analysis

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How fast is master's hiring at 北京华封集芯电子有限公司 growing? Master's recruitment over the years: 2026: 36 openings (up 472%), 2022: 1 openings.

R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 北京华封集芯电子有限公司? Based on an analysis of 's job postings over the past year, "电子/电器/通信技术类" demand: 28.4%, "其他(研发和技术类)": 21.9%, "计算机/网络/技术类": 16.5%, "生物/制药/化工/环保类": 6.1%, "机械/仪器仪表类": 3.6%, "美术/设计/创意类": 1.8%. For reference only.

— What Are the Salaries Like? (278 records)

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salary range: 3K - 50K, 64.7% of roles pay ¥20-50K
Note: salary statistics are based on 278 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 北京华封集芯电子有限公司?64.7% of positions earn 20-50K, Fresh graduate salary: ¥25.0K。Beijing salary ranking top 45,电子/电器/通信技术类 average salary ¥41.1K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of

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Are salaries high at 北京华封集芯电子有限公司? We provide: 设计工程师,pi,培训,ic设计,ic验证,设备工,采购,融资,验证工程师,ie,后端,硬件,算法,设计高级工程师,质量,销售,行政,工艺工程,招聘专员,绩效经理. Click to view detailed salary analysis by job.

Related Industry Tags

Tags are auto-annotated by keyword text matching and may be correlated. For reference only.

Job Category

  • 电子/电器/通信技术类
    27.9% of total 27.9%
  • 其他(研发和技术类)
    21.5% of total 21.5%
  • 计算机/网络/技术类
    15.2% of total 15.2%
  • 工厂生产类
    13.6% of total 13.6%

Education

  • 本科
    69.4% of total 69.4%
  • 不限
    11.5% of total 11.5%
  • 硕士
    10.9% of total 10.9%
  • 大专
    7% of total 7%

Experience

  • 5-10年
    33% of total 33%
  • 不限
    27% of total 27%
  • 3-5年
    20% of total 20%
  • 1-3年
    10.3% of total 10.3%
View Detailed Analysis

What does 北京华封集芯电子有限公司 require? Who is 北京华封集芯电子有限公司 hiring? recruitment: 电子/电器/通信技术类占比最多占27.9%,其次是其他(研发和技术类)占21.5%. What education can get in at ? 本科占比最多占69.4%,其次是不限占11.5%. High education required at ? 硕士占10.9%. Work experience required at ? 5-10年占比最多占33%,其次是不限占27%. Where are the job locations at ? 北京占比最多占79.4%,其次是西安占11.2%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 50,147.1164万(元)
Legal Representative: 李宗芳
Date Established:
Credit Code: 91110400MA028J9R2E
Registered Address: 北京市北京经济技术开发区荣昌东街甲5号3号楼6层601-5(北京自贸试验区高端产业片区亦庄组团)

Partners & Suppliers

为兆易创新提供存储芯片封装测试服务 Source
合作客户 芯片封测
为华为海思提供集成电路封装测试服务 Source
合作客户 芯片封测
为中兴微电子提供封装测试服务 Source
合作客户 芯片封测

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