About the Company

成都高投芯未半导体有限公司设立于2022年1月,注册资本1亿RMB,是由成都高新投资集团有限公司和成都森未科技有限公司共同出资设立的国有控股公司,致力于成为国际标杆的集成功率器件制造服务商。

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Business Registration

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Operating Status: 开业
Registered Capital: 30,000万(元)
Legal Representative: 孟繁新
Date Established:
Credit Code: 91510100MA7GPDU31M
Registered Address: 成都高新区康强三路1111号

Partners & Suppliers

作为合资股东和供应商,提供功率半导体封装测试服务 Source
供应商 芯片封测

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