Discover Great Companies Discover Great Clients
Companies Salaries Jobs
Jobs |
Jobs Companies Salary Majors

About the Company

成都高投芯未半导体有限公司设立于2022年1月,注册资本1亿RMB,是由成都高新投资集团有限公司成都森未科技有限公司共同出资设立的国有控股公司,致力于成为国际标杆的集成功率器件制造服务商。

Expand
Information is aggregated from the web and may not be exact. For reference only.
Information incorrect? Claim this company to edit

honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

Related Industry Tags

Tags are auto-annotated by keyword text matching and may be correlated. For reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 30,000万(元)
Legal Representative: 孟繁新
Date Established:
Credit Code: 91510100MA7GPDU31M
Registered Address: 成都高新区康强三路1111号

Partners & Suppliers

作为合资股东和供应商,提供功率半导体封装测试服务 Source
供应商 芯片封测

People who follow this company also follow

Competitors (Similar Companies)

集成电路 封装测试 半导体 芯粒chiplet
“集成电路封装技术研发商”
清洁能源 氢能源 生产 化工能源
“光模块解决方案与服务提供商”
乳业 乳制品 绿色农业 销售
生产 代加工 制造 工业
生物工程 生物科技 医疗器械 生产
厨具 厨房设备 生产 代加工
开关设备 断路器 开关 测试设备
“易明精神:真诚,精致,创新,责任”
模具制造 冲压模具 精密塑胶 精密零件加工
显示器件 薄膜 光电 传感器
食品 饲料 食品加工 面粉
“半导体装配及封装设备、材料及表面贴装技术供应商”
休闲食品/零食 豆干 凤爪 泡椒

Report

*Reason:

Radical political or ideological topics
Advertising or spam
Pornographic or vulgar content
Obscene language or personal attacks
Other

Congratulations, submitted successfully!

Your edit is under review. You will be notified by email within 1 business day.

Submission failed.

Followed successfully. We'll notify you of any company updates.

Help others learn about this company, add my impression of this company»

Log in with the following accounts to save your follows

Followed successfully, we'll notify you of any company updates

建筑工程机械
客服
由百度提供