Company Overview

Development Stage

About the Company

浙江海纳半导体股份有限公司成立于2002年9月,前身是1970年成立的浙江大学半导体厂,始终秉承“求是创新”的浙江大学校训作为公司经营理念,发展至今逐步形成了“纯净完美、同创共享”的海纳人共同价值观和“海纳百川、宁静致远”的海纳精神。
公司是中国半导体行业协会会员单位、中国电子材料行业协会会员单位、浙江省半导体行业协会理事单位。设有省级高新技术企业研究开发中心、市级企业技术中心、是省科技型企业,同时拥有多项具有自主知识产权的发明专利,在硅材料制造领域积累了丰富的经验和技术,目前是我国主要的半导体器件单晶硅材料供应商之一。
公司在硅单晶体生长技术、硅材料缺陷研究、硅片切割研磨、硅晶圆抛光技术、硅片检测等各个方面都有着深入的研究和开发。是一家集研发、制造、销售及服务为一体的国高新技术企业。

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海纳股份 Financing History (1 rounds)

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新三板
Capital Market Favor
Latest Financing Round
  • Date: ?
  • Market: 新三板
  • Deal: 全国股转系统

海纳股份 How Fast Is Hiring Growing? (34 open positions)

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?
Growth Rate
2026 vs 2025
  • 2025: Up 239%
  • 2024: Up 47%
  • 2023: Up 533%
  • 2022: Down 81%
海纳股份 Year-by-Year Hiring:
* Hiring was generally low during 2020-2022 due to the pandemic
海纳股份 Campus Recruitment & Advanced Degree Talent Demand
Master's 1 Doctorate 1
Note: How fast is hiring at 浙江海纳半导体股份有限公司 growing? 海纳股份2026: 77 openings (down 19%), 2025: 95 openings (up 239%), 2024: 28 openings (up 47%), 2023: 19 openings (up 533%), 2022: 3 openings (down 81%), 2021: 16 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

海纳股份 Master's Degree Job Demand Analysis

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+100%
Growth Rate
2026 vs 2025
海纳股份 Master's Hiring by Year: 2026 — 1 more jobs than 2025
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 浙江海纳半导体股份有限公司 growing? 海纳股份Master's recruitment over the years: 2026: 2 openings (down 19%), 2025: 1 openings (up 239%), 2023: 1 openings (up 533%).

海纳股份 R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 浙江海纳半导体股份有限公司? Based on an analysis of 海纳股份's job postings over the past year, "电子/电器/通信技术类" demand: 12.1%, "其他(研发和技术类)": 5.2%, "生物/制药/化工/环保类": 4.3%, "机械/仪器仪表类": 3.4%, "电气/能源/动力类": 2.6%, "计算机/网络/技术类": 0.9%. For reference only.

海纳股份 — What Are the Salaries Like? (116 records)

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海纳股份 Salary Overview
salary range: 4.5K - 50K, 54.3% of roles pay ¥8-15K
Note: salary statistics are based on 116 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 浙江海纳半导体股份有限公司?海纳股份54.3% of positions earn 8-15K, Undergraduate salary: ¥。Quzhou salary ranking top 35,财务/审计/统计类 average salary ¥11.0K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of 海纳股份

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Are salaries high at 浙江海纳半导体股份有限公司? We provide: 法务,审计,质量,人力,工艺工程,研发工程师,财务,ie,pi,技工,测试员,设备工,设备技术,采购,hr,市场,接待,操作工,普工,自动化. Click to view detailed salary analysis by job.

海纳股份 honors, qualifications & industry associations

Job Category

  • 财务/审计/统计类
    19.8% of total 19.8%
  • 技工类
    19% of total 19%
  • 工厂生产类
    18.1% of total 18.1%
  • 质量管理类
    15.5% of total 15.5%

Education

  • 本科
    62.9% of total 62.9%
  • 大专
    29.3% of total 29.3%
  • 高中
    3.4% of total 3.4%
  • 硕士
    2.6% of total 2.6%

Experience

  • 1-3年
    42.2% of total 42.2%
  • 3-5年
    25.9% of total 25.9%
  • 不限
    17.2% of total 17.2%
  • 5-10年
    14.7% of total 14.7%
View Detailed Analysis

What does 浙江海纳半导体股份有限公司 require? Who is 海纳股份 hiring? 海纳股份 recruitment: 财务/审计/统计类占比最多占19.8%,其次是技工类占19%. What education can get in at 海纳股份? 本科占比最多占62.9%,其次是大专占29.3%. High education required at 海纳股份? 硕士占2.6%,博士占0.9%. Work experience required at 海纳股份? 1-3年占比最多占42.2%,其次是3-5年占25.9%. Where are the job locations at 海纳股份? 杭州占比最多占36.2%,其次是金华占36.2%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 10,764.794万(元)
Legal Representative: 何昊
Date Established:
Credit Code: 913301087429442466
Registered Address: 浙江省开化县华埠镇万向路5号

Partners & Suppliers

浙江海纳半导体股份有限公司采购盛美上海的单片清洗设备,用于硅片清洗工艺。 Source
供应商 半导体设备
浙江海纳半导体股份有限公司向积塔半导体供应硅片,用于汽车电子等领域的芯片制造。 Source
合作客户 晶圆代工
浙江海纳半导体股份有限公司是华虹半导体的硅片供应商之一,提供抛光硅片等产品。 Source
合作客户 晶圆代工
浙江海纳半导体股份有限公司从信越化学采购高纯度多晶硅等原材料,用于生产硅片。 Source
供应商 半导体材料
浙江海纳半导体股份有限公司向东京电子采购刻蚀设备等,用于硅片加工。 Source
供应商 半导体设备

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