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Company Overview

Development Stage

About the Company

成都矽联讯半导体科技有限公司(SUC SemiconductTechnology)是一家专注于国产芯片自 主研发、生产、销售为一体的高新技术企业。总部位于 四川省成都市双流区,占地面积约1500平方米。 致力于高端模拟信号链芯片及数模混合芯片研发设计, 竭尽所能为客户提供先进、可靠、系统的解决方案与产品服务。公司拥有丰富的产品组合、广泛的市场布局以及严格的质量管控体系。 公司自成立以来,就注重高端模拟信号链芯片、数模 混合芯片的自主研发设计与生产,目前,产品线涵盖ADC 芯片、DAC芯片、降压DC/DC、升压DC/DC、PMIC、LDO线 性稳压、驱动、基准、负载开关、模拟开关、运放、MCU、 传感器等;应用范围涉及新能源与汽车、工业控制、医 疗健康、仪器仪表、通信设备等众多领域。 公司拥有一条全自动化的自主筛选测试线,能够具备 功率器件和ADC以高精度产品的量产测试出货能力。

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How Fast Is Hiring Growing? (14 open positions)

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Note: How fast is hiring at 成都矽联讯半导体科技有限公司 growing? 2025: 20 openings (up 900%), 2024: 2 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 成都矽联讯半导体科技有限公司? Based on an analysis of 's job postings over the past year, "电子/电器/通信技术类" demand: 54.2%, "其他(研发和技术类)": 20.8%. For reference only.

— What Are the Salaries Like? (24 records)

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salary range: 4.5K - 50K, 66.7% of roles pay ¥6-15K
Note: salary statistics are based on 24 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 成都矽联讯半导体科技有限公司?66.7% of positions earn 6-15K, Fresh graduate salary: ¥23.5K。电子/电器/通信技术类 average salary ¥14.7K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of

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Are salaries high at 成都矽联讯半导体科技有限公司? We provide: 销售,ae,fa,会计,应用工程师,技术工程师,财务,内勤,技术支持,招生,测试工程,电路设计,设计师. Click to view detailed salary analysis by job.

honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

Related Industry Tags

Job Category

  • 电子/电器/通信技术类
    55.6% of total 55.6%
  • 销售类
    33.3% of total 33.3%
  • 其他(研发和技术类)
    22.2% of total 22.2%
  • 行政/后勤类
    18.5% of total 18.5%

Education

  • 本科
    88.9% of total 88.9%
  • 大专
    7.4% of total 7.4%
  • 硕士
    3.7% of total 3.7%

Experience

  • 3-5年
    40.7% of total 40.7%
  • 1-3年
    25.9% of total 25.9%
  • 不限
    18.5% of total 18.5%
  • 应届生
    7.4% of total 7.4%
View Detailed Analysis

What does 成都矽联讯半导体科技有限公司 require? Who is 成都矽联讯半导体科技有限公司 hiring? recruitment: 电子/电器/通信技术类占比最多占55.6%,其次是销售类占33.3%. What education can get in at ? 本科占比最多占88.9%,其次是大专占7.4%. High education required at ? 硕士占3.7%. Work experience required at ? 3-5年占比最多占40.7%,其次是1-3年占25.9%. Where are the job locations at ? 成都占比最多占63%,其次是西安占11.1%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 1,000万(元)
Legal Representative: 聂峥
Date Established:
Credit Code: 91510107MA69LTJR1W
Registered Address: 中国(四川)自由贸易试验区成都市双流区西南航空港经济开发区华府大道四段777号

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