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Company Overview

Development Stage

About the Company

芯扬聚阵(杭州)微电子有限公司(以下简称“芯扬聚阵”)成立于2022年,是上市公司烟台睿创微纳股份有限公司的控股子公司。芯扬聚阵是一家专注于高端相控阵射频芯片研发和产业化的公司,通过芯扬聚阵创新性工作,指引全球相控阵芯片技术和产业发展,让相控阵不再复杂。

卫星通信领域的*

芯扬聚阵在卫星通信相控阵芯片研发和产业化方面拥有丰富的经验。芯扬聚阵在低功耗、高集成度和系统易用性等方面处于世界前沿地位,是中国版starlink的核心供应商,为国产卫星通信产业的发展以及全球低轨卫星星座高边疆竞争做出了重要贡献。

数字相控阵技术*

芯扬聚阵是宽带数字相控阵芯片的技术*。数字相控阵在下一代无线通信、无人机图传等领域具有广泛应用前景。芯扬聚阵通过创新的低功耗高速ADCDAC技术和宽带射频架构,推动无线通信向更低延时、更大带宽方向进步,为客户提供更便捷、更可靠的完整解决方案。

创新驱动的汽车技术

芯扬聚阵还专注于4D成像毫米波芯片和相控阵系统的研发。芯扬聚阵结合母公司睿创微纳在全球红外芯片领域的技术优势,为汽车自动驾驶传感器和车联网提供高性价比解决方案。芯扬聚阵立志推动汽车智能技术的创新发展,为智慧交通领域带来更安全、更智能的解决方案。

产品方向

芯扬聚阵主要产品方向为硅基相控阵射频芯片。具体包括硅基模拟相控阵射频芯片(ABF)、硅基数字相控阵射频收发芯片(DBF Transceiver)以及硅基4D毫米波雷达芯片三大产品线。

应用领域

主要应用于卫星通信相控阵终端及地面通信终端、5G/6G MIMO通信系统、WIFI7及宽带图像传输系统以及汽车雷达等市场领域。

相控阵射频芯片是低轨卫星、低空通航管理、汽车自动驾驶等多种应用场景的重要核心基础芯片,是上述未来产业发展和市场化推广的瓶颈。通过宽带相控阵射频芯片研制,可以突破目前国内高端射频芯片供应链被卡脖子的现状,促进上下游,如低轨卫星星座及终端应用、6G通信网络、低空经济及智能汽车等关键产业的形成和发展,具有巨大的经济和社会效益。

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Information is aggregated from the web and may not be exact. For reference only.
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芯扬聚阵 Recruitment Overview / Current Status (6 open positions)

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Note: How fast is hiring at 芯扬聚阵(杭州)微电子有限公司 growing? 芯扬聚阵2026: 18 openings, 2025: 2 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

芯扬聚阵 R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 芯扬聚阵(杭州)微电子有限公司? Based on an analysis of 芯扬聚阵's job postings over the past year, "电子/电器/通信技术类" demand: 88%, "其他(研发和技术类)": 52%, "计算机/网络/技术类": 20%, "生物/制药/化工/环保类": 8%. For reference only.

芯扬聚阵 — What Are the Salaries Like? (25 records)

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salary range: 2K - 50K, 72% of roles pay ¥20-50K
Note: salary statistics are based on 25 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 芯扬聚阵(杭州)微电子有限公司?芯扬聚阵72% of positions earn 20-50K, Fresh graduate salary: ¥2.5K。Hangzhou salary ranking: #506,电子/电器/通信技术类 average salary ¥23.1K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of 芯扬聚阵

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Are salaries high at 芯扬聚阵(杭州)微电子有限公司? We provide: 设计工程师,芯片设计,ae,dft,fa,ic设计,嵌入式,软件工程,验证工程师,fpga,ic工程师,oc,pi,后端,应用工程师,模拟ic,测试工程,电路设计,硬件,算法. Click to view detailed salary analysis by job.

Job Category

  • 电子/电器/通信技术类
    88% of total 88%
  • 其他(研发和技术类)
    52% of total 52%
  • 计算机/网络/技术类
    20% of total 20%
  • 在校学生类
    12% of total 12%

Education

  • 本科
    64% of total 64%
  • 硕士
    24% of total 24%
  • 不限
    12% of total 12%

Experience

  • 3-5年
    48% of total 48%
  • 1-3年
    36% of total 36%
  • 应届生
    8% of total 8%
  • 不限
    8% of total 8%
View Detailed Analysis

What does 芯扬聚阵(杭州)微电子有限公司 require? Who is 芯扬聚阵 hiring? 芯扬聚阵 recruitment: 电子/电器/通信技术类占比最多占88%,其次是其他(研发和技术类)占52%. What education can get in at 芯扬聚阵? 本科占比最多占64%,其次是硕士占24%. High education required at 芯扬聚阵? 硕士占24%. Work experience required at 芯扬聚阵? 3-5年占比最多占48%,其次是1-3年占36%. Where are the job locations at 芯扬聚阵? 杭州占比最多占100%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 100万(元)
Legal Representative: 刘东栋
Date Established:
Credit Code: 91330108MAC3T9TJ4Y
Registered Address: 浙江省杭州市滨江区西兴街道月明路560号1幢1号楼2112室

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