Company Overview

Development Stage

About the Company

[Summary] 5G万物互联连接芯片企业

星思半导体简介
一、 公司介绍
上海星思半导体聚焦5G/6G通信技术,为客户提供有竞争力的全场景天地一体化基带芯片及解决方案,包括5G/6G eMBB、RedCap及 NTN的终端/手机基带芯片平台和解决方案。

公司拥有一支由业界资深专家组成的技术研发团队,有丰富的无线通信、数据通信、芯片设计验证和芯片量产经验,配备Palladium、Zebu、HAPS、KEYSIGHT等大型仿真加速器、综测仪等软硬件平台,可独立完成超大规模芯片设计、验证、以及测试调试等工作。

产业应用覆盖手机直连卫星、卫星通信终端、机载通信、无人机自组网、eVTOL通感、车载通信、智能座舱、5G FWA固定无线接入、应急通信、集群通信、工业物联及行业应用等5G/6G万物互联和卫星通信场景。



二、 公司分布和办公地点
上海市张江微电子港
南京市江北新区研创园
成都高新区创合中心

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上海星思半导体有限责任公司 Financing History (10 rounds)

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战略投资
Capital Market Favor
Latest Financing Round
  • Date: ?
  • Amount: 数亿人民币
  • Investor: 上海信投,新华网,通鼎互联...

上海星思半导体有限责任公司 Recruitment Overview / Current Status (87 open positions)

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Growth Rate
2026 vs 2025
  • 2025: Down 5%
  • 2024: Down 31%
  • 2023: Down 69%
  • 2022: Down 19%
上海星思半导体有限责任公司 Year-by-Year Hiring:
* Hiring was generally low during 2020-2022 due to the pandemic
上海星思半导体有限责任公司 Campus Recruitment & Advanced Degree Talent Demand
Master's 5
Note: How fast is hiring at 上海星思半导体股份有限公司 growing? 上海星思半导体有限责任公司2025: 41 openings (down 5%), 2024: 43 openings (down 31%), 2023: 62 openings (down 69%), 2022: 199 openings (down 19%), 2021: 247 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

上海星思半导体有限责任公司 Master's Degree Job Demand Analysis

(More)
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Growth Rate
2026 vs 2025
  • 2025: Down 8%
  • 2024: Down 38%
  • 2023: Down 34%
  • 2022: Up 10%
上海星思半导体有限责任公司 Master's Hiring by Year:
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 上海星思半导体股份有限公司 growing? 上海星思半导体有限责任公司Master's recruitment over the years: 2025: 12 openings (down 8%), 2024: 13 openings (down 38%), 2023: 21 openings (down 34%), 2022: 32 openings (up 10%), 2021: 29 openings.

上海星思半导体有限责任公司 R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 上海星思半导体股份有限公司? Based on an analysis of 上海星思半导体有限责任公司's job postings over the past year, "电子/电器/通信技术类" demand: 63.6%, "其他(研发和技术类)": 48.2%, "计算机/网络/技术类": 28.2%, "生物/制药/化工/环保类": 3.6%, "美术/设计/创意类": 0.9%. For reference only.

上海星思半导体有限责任公司 — What Are the Salaries Like? (110 records)

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上海星思半导体有限责任公司 Salary Overview
salary range: 10K - 50K, 77.3% of roles pay ¥20-50K
Note: salary statistics are based on 110 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 上海星思半导体股份有限公司?上海星思半导体有限责任公司77.3% of positions earn 20-50K, Undergraduate salary: ¥。Shanghai salary ranking top 40,电子/电器/通信技术类 average salary ¥33.7K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of 上海星思半导体有限责任公司

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Are salaries high at 上海星思半导体股份有限公司? We provide: 测试工程,软件工程,基础架构,开发测试,销售,ae,fa,分析,客户支持,售后,嵌入式,管理工程师,cad,交付经理,封装工程师,开发工程师,研发工程师,芯片验证,规划,质量. Click to view detailed salary analysis by job.

上海星思半导体有限责任公司 honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

上海星思半导体有限责任公司 Related Industry Tags

Job Category

  • 电子/电器/通信技术类
    63.6% of total 63.6%
  • 其他(研发和技术类)
    48.2% of total 48.2%
  • 计算机/网络/技术类
    28.2% of total 28.2%
  • 质量管理类
    13.6% of total 13.6%

Education

  • 本科
    69.1% of total 69.1%
  • 硕士
    30.9% of total 30.9%

Experience

  • 3-5年
    40.9% of total 40.9%
  • 5-10年
    31.8% of total 31.8%
  • 1-3年
    21.8% of total 21.8%
  • 不限
    5.5% of total 5.5%
View Detailed Analysis

What does 上海星思半导体股份有限公司 require? Who is 上海星思半导体有限责任公司 hiring? 上海星思半导体有限责任公司 recruitment: 电子/电器/通信技术类占比最多占63.6%,其次是其他(研发和技术类)占48.2%. What education can get in at 上海星思半导体有限责任公司? 本科占比最多占69.1%,其次是硕士占30.9%. High education required at 上海星思半导体有限责任公司? 硕士占30.9%. Work experience required at 上海星思半导体有限责任公司? 3-5年占比最多占40.9%,其次是5-10年占31.8%. Where are the job locations at 上海星思半导体有限责任公司? 上海占比最多占46.4%,其次是南京占30%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 3,032.9211万(元)
Legal Representative: 夏庐生
Date Established:
Credit Code: 91310112MA1GDQ1P62
Registered Address: 中国(上海)自由贸易试验区碧波路690号5幢401室、402室

Partners & Suppliers

星思半导体5G基带芯片采用台积电6nm工艺流片 Source
供应商 芯片代工
与星思半导体签署战略合作协议,在5G芯片和模组领域合作 Source
合作客户 通信设备商
星思半导体5G模组入围中国移动集采 Source
合作客户 通信运营商
与星思半导体签署战略合作协议,共同推动5G行业应用 Source
合作客户 通信运营商

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