江苏鼎茂半导体有限公司专注于MENS超高真空陶瓷、CSP/WLP封装及半导体器件研发、设计、制造及销售。随着MEMS产业迅速发展,MEMS走向大规模分工,一大批晶圆设计公司的兴起给专业的晶圆厂和封测厂带来了机遇,在目前方案中,晶圆级封装前景,而3D晶圆级封装把MEMS和ASIC整合在一起,从而进一步提升效率和缩减尺寸。在热成像MEMS研制行业里,其真空陶瓷封装和CSP/WLP晶圆封装的技术长期成为这个行业的发展瓶颈,鼎茂拥有的核心超高真空封装技术突破性的成功,实现了数倍于现有技术的封装效率,大幅度提高量产能力,同时大大减低能耗和对洁净环境的依赖。
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