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Company Overview

Development Stage

About the Company

宝浦莱半导体有限公司成立于2011年10月,注册资本15000万元,总投资8亿元,产品覆盖5G类半导体分立器件。广泛用于手机,车载,家电等终端产品,目前服务的客户有三星华为小米,强茂以及创维比亚迪等知名企业,先后获得了,省企业技术中心,省工程技术研究中心,宿迁精品等荣誉称号,拥有发明专利2项,实用新型32项,致力于成为*的半导体封装工厂

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Information is aggregated from the web and may not be exact. For reference only.
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How Fast Is Hiring Growing? (1 open positions)

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?
Growth Rate
2026 vs 2025
  • 2025: Up 88%
  • 2024: Down 16%
  • 2023: Up 850%
  • 2022: Down 89%
Year-by-Year Hiring:
* Hiring was generally low during 2020-2022 due to the pandemic
Note: How fast is hiring at 江苏宝浦莱半导体有限公司 growing? 2025年30个(增长88%),2024年16个(下降16%),2023年19个(增长850%),2022年2个(下降89%),2021年19个. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

R&D Strength (Technical Talent Demand)

(More)
How is the demand for technical talent at 江苏宝浦莱半导体有限公司? Based on an analysis of 's job postings over the past year, “电子/电器/通信技术类”需求占73.3%,“其他(研发和技术类)”占6.7%,“机械/仪器仪表类”占6.7%,“电气/能源/动力类”占6.7%. For reference only.

— What Are the Salaries Like? (15 records)

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salary range: 4.5K - 30K, 53.3% of roles pay ¥10-20K
Note: salary statistics are based on 15 salary records from the past year and depend on the job sample. For reference only.
江苏宝浦莱半导体有限公司工资待遇怎么样?53.3%的岗位拿10-20K,本科工资¥。宿迁地区工资排名前20%,与同行业比+54%,电子/电器/通信技术类平均工资¥13.8K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

Related Industry Tags

Tags are auto-annotated by keyword text matching and may be correlated. For reference only.

Job Category

  • 电子/电器/通信技术类
    73.3% of total 73.3%
  • 技工类
    33.3% of total 33.3%
  • 质量管理类
    33.3% of total 33.3%
  • 工厂生产类
    26.7% of total 26.7%

Education

  • 大专
    80% of total 80%
  • 本科
    20% of total 20%

Experience

  • 3-5年
    46.7% of total 46.7%
  • 不限
    26.7% of total 26.7%
  • 1-3年
    20% of total 20%
  • 5-10年
    6.7% of total 6.7%
View Detailed Analysis

What does 江苏宝浦莱半导体有限公司 require? Who is 江苏宝浦莱半导体有限公司 hiring? 招聘类别电子/电器/通信技术类占比最多占73.3%,其次是技工类占33.3%。什么学历能进?大专占比最多占80%,其次是本科占20%。工作经验有什么要求?3-5年占比最多占46.7%,其次是不限占26.7%。工作地区在哪?宿迁占比最多占100%。 Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 15,000万(元)
Legal Representative: 张建军
Date Established:
Credit Code: 91321323583720412H
Registered Address: 泗阳县经济开发区黄河路36号

Partners & Suppliers

采购半导体封装设备 Source
供应商 半导体设备
采购半导体封装设备 Source
供应商 半导体设备
采购环氧塑封料 Source
供应商 环氧塑封料
采购引线框架等封装材料 Source
供应商 引线框架
通过母公司华天科技提供封装测试服务 Source
合作客户 芯片设计/IP

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Competitors (Similar Companies)

半导体 传感器 传感器模块 定制
“专注于半导体封装与测试成品制造”
连接器 继电器 延时继电器 低功耗
微动开关 连接器 端子 接插件
“专业制作高精密度,大尺寸印制电路板,产品主要适用于电脑、网络设备、通信设备等行业”
低压配电 逆变器 智能配电 光伏并网逆变
“功率及数模混合芯片设计”
光电 仪器/仪表 农业装备 光通信器件
电子厂/电子 微电子 芯片制造 芯片
芯片 集成电路 集成电路封装测试 封装测试
““光”与“感测”相关半导体组件开发商”
“北斗视觉增强芯片研发商”
“半导体芯片的研发、生产、销售和服务。”
“半导体领域技术开发与服务商”
传感器 人工智能 智能传感器 激光雷达

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