Company Overview

Development Stage

About the Company

宝浦莱半导体有限公司成立于2011年10月,注册资本15000万元,总投资8亿元,产品覆盖5G类半导体分立器件。广泛用于手机,车载,家电等终端产品,目前服务的客户有三星,华为,小米,强茂以及创维,比亚迪等知名企业,先后获得了,省企业技术中心,省工程技术研究中心,宿迁精品等荣誉称号,拥有发明专利2项,实用新型32项,致力于成为*的半导体封装工厂

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Information is aggregated from the web and may not be exact. For reference only.
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How Fast Is Hiring Growing? (3 open positions)

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?
Growth Rate
2026 vs 2025
  • 2025: Up 88%
  • 2024: Down 16%
  • 2023: Up 850%
  • 2022: Down 89%
Year-by-Year Hiring:
* Hiring was generally low during 2020-2022 due to the pandemic
Note: How fast is hiring at 江苏宝浦莱半导体有限公司 growing? 2025: 30 openings (up 88%), 2024: 16 openings (down 16%), 2023: 19 openings (up 850%), 2022: 2 openings (down 89%), 2021: 19 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

R&D Strength (Technical Talent Demand)

(More)
How is the demand for technical talent at 江苏宝浦莱半导体有限公司? Based on an analysis of 's job postings over the past year, "电子/电器/通信技术类" demand: 64.7%, "其他(研发和技术类)": 5.9%, "机械/仪器仪表类": 5.9%, "电气/能源/动力类": 5.9%. For reference only.

— What Are the Salaries Like? (17 records)

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salary range: 4.5K - 30K, 58.8% of roles pay ¥6-15K
Note: salary statistics are based on 17 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 江苏宝浦莱半导体有限公司?58.8% of positions earn 6-15K, Undergraduate salary: ¥。Suqian salary ranking top 20,电子/电器/通信技术类 average salary ¥13.8K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

Related Industry Tags

Tags are auto-annotated by keyword text matching and may be correlated. For reference only.

Job Category

  • 电子/电器/通信技术类
    64.7% of total 64.7%
  • 技工类
    35.3% of total 35.3%
  • 质量管理类
    35.3% of total 35.3%
  • 工厂生产类
    29.4% of total 29.4%

Education

  • 大专
    82.4% of total 82.4%
  • 本科
    17.6% of total 17.6%

Experience

  • 3-5年
    41.2% of total 41.2%
  • 1-3年
    23.5% of total 23.5%
  • 不限
    23.5% of total 23.5%
  • 5-10年
    11.8% of total 11.8%
View Detailed Analysis

What does 江苏宝浦莱半导体有限公司 require? Who is 江苏宝浦莱半导体有限公司 hiring? recruitment: 电子/电器/通信技术类占比最多占64.7%,其次是技工类占35.3%. What education can get in at ? 大专占比最多占82.4%,其次是本科占17.6%. Work experience required at ? 3-5年占比最多占41.2%,其次是1-3年占23.5%. Where are the job locations at ? 宿迁占比最多占100%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 15,000万(元)
Legal Representative: 张建军
Date Established:
Credit Code: 91321323583720412H
Registered Address: 泗阳县经济开发区黄河路36号

Partners & Suppliers

采购半导体封装设备 Source
供应商 半导体设备
采购半导体封装设备 Source
供应商 半导体设备
采购环氧塑封料 Source
供应商 环氧塑封料
采购引线框架等封装材料 Source
供应商 引线框架
通过母公司华天科技提供封装测试服务 Source
合作客户 芯片设计/IP

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“Professional production of automotive seat headrests and armrests”

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