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About the Company

[Summary] 高性能信号链集成电路产品的半导体公司

芯聚威科技设立在成都高新区,公司技术团队掌握多种架构和性能指标的高性能模数转换器和数模转换器(ADC/DAC),放大器、电压基准等研发能力,具备高性能信号链芯片的自主研发和量产实力,致力于开发高性能模拟与模数混合集成电路芯片。自主研发的模数混合芯片设计公司。
核心技术成员分别在学术界和工业界专注数据转换器研发10余年,承担多项国家重点科研和科技攻关项目,具有量产多个型号高性能模拟与模数混合芯片的经验,在高性能数据转换器技术层面已做到行业前列。

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芯聚威科技 Financing History (6 rounds)

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Pre-A+轮
Capital Market Favor
Latest Financing Round
  • Date: ?
  • Amount: 数千万人民币
  • Investor: 成都高投集团,川创投,长虹...

芯聚威科技 How Fast Is Hiring Growing? (4 open positions)

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Growth Rate
2026 vs 2025
  • 2025: Down 19%
  • 2024: Down 16%
  • 2023: Up 111%
芯聚威科技 Year-by-Year Hiring:
* Hiring was generally low during 2020-2022 due to the pandemic
芯聚威科技 Campus Recruitment & Advanced Degree Talent Demand
Master's 2
Note: How fast is hiring at 芯聚威科技(成都)有限公司 growing? 芯聚威科技2025: 13 openings (down 19%), 2024: 16 openings (down 16%), 2023: 19 openings (up 111%), 2022: 9 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

芯聚威科技 Master's Degree Job Demand Analysis

(More)
?
Growth Rate
2026 vs 2025
  • 2025: Up 40%
  • 2024: Flat 0%-
  • 2023: Up 25%
芯聚威科技 Master's Hiring by Year:
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 芯聚威科技(成都)有限公司 growing? 芯聚威科技Master's recruitment over the years: 2025: 7 openings (up 40%), 2024: 5 openings (flat), 2023: 5 openings (up 25%), 2022: 4 openings.

芯聚威科技 R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 芯聚威科技(成都)有限公司? Based on an analysis of 芯聚威科技's job postings over the past year, "电子/电器/通信技术类" demand: 88.9%, "其他(研发和技术类)": 22.2%, "计算机/网络/技术类": 5.6%. For reference only.

芯聚威科技 — What Are the Salaries Like? (18 records)

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芯聚威科技 Salary Overview
salary range: 8K - 50K, 55.5% of roles pay ¥20-50K
Note: salary statistics are based on 18 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 芯聚威科技(成都)有限公司?芯聚威科技55.5% of positions earn 20-50K, Undergraduate salary: ¥。Chengdu salary ranking top 10,电子/电器/通信技术类 average salary ¥30.5K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

芯聚威科技 honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

芯聚威科技 Related Industry Tags

Job Category

  • 电子/电器/通信技术类
    88.9% of total 88.9%
  • 其他(研发和技术类)
    22.2% of total 22.2%
  • 销售类
    11.1% of total 11.1%
  • 项目管理类
    11.1% of total 11.1%

Education

  • 硕士
    55.6% of total 55.6%
  • 本科
    44.4% of total 44.4%

Experience

  • 3-5年
    44.4% of total 44.4%
  • 1-3年
    27.8% of total 27.8%
  • 5-10年
    27.8% of total 27.8%
View Detailed Analysis

What does 芯聚威科技(成都)有限公司 require? Who is 芯聚威科技 hiring? 芯聚威科技 recruitment: 电子/电器/通信技术类占比最多占88.9%,其次是其他(研发和技术类)占22.2%. What education can get in at 芯聚威科技? 硕士占比最多占55.6%,其次是本科占44.4%. High education required at 芯聚威科技? 硕士占55.6%. Work experience required at 芯聚威科技? 3-5年占比最多占44.4%,其次是1-3年占27.8%. Where are the job locations at 芯聚威科技? 成都占比最多占88.9%,其次是深圳占11.1%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 356.4065万(元)
Legal Representative: 周雄
Date Established:
Credit Code: 91510100MA69YB2B4Q
Registered Address: 中国(四川)自由贸易试验区成都高新区天府大道中段1268号1栋12层23、25号

Partners & Suppliers

芯聚威科技与电子科技大学共建联合实验室,共同研发模拟集成电路技术 Source
合作客户 高校合作
芯聚威科技向中兴通讯提供数据转换器芯片 Source
合作客户 通信设备客户
芯聚威科技向华为提供高速ADC芯片用于5G基站 Source
合作客户 通信设备客户
芯聚威科技使用Cadence的EDA工具进行芯片设计与仿真 Source
供应商 EDA工具
芯聚威科技的芯片封装与测试由华天科技提供 Source
供应商 芯片封测

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