[Summary] 打造高端半导体用封装界面材料民族品牌
深圳芯源新材料有限公司是一家以高导热封装互连材料为核心的科技企业。公司专注于以纳米金属产品为代表的半导体用散热封装材料的研发、生产、销售和技术服务,为功率半导体封装、先进集成电路封装提供高散热、高可靠的解决方案。
公司材料研发部门由十余名博士和硕士以及多位实验员组成,成功研制车规级烧结银产品、通讯级烧结银产品、光电封装导热银胶、集成电路用热界面材料”等系列产品。与哈工大 (深圳)共建校企联合实验室,联合培养博士、硕士生,布局更多新产品方向。
What does 深圳芯源新材料有限公司 require? Who is 芯源新材 hiring? 芯源新材 recruitment: 其他(研发和技术类)占比最多占24.6%,其次是质量管理类占20.3%. What education can get in at 芯源新材? 本科占比最多占52.2%,其次是大专占36.2%. High education required at 芯源新材? 硕士占4.3%,博士占1.4%. Work experience required at 芯源新材? 3-5年占比最多占34.8%,其次是1-3年占27.5%. Where are the job locations at 芯源新材? 深圳占比最多占95.7%,其次是苏州占4.3%. Based on job postings from the past year, for reference only.
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