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About the Company

[Summary] 打造高端半导体用封装界面材料民族品牌

深圳芯源新材料有限公司是一家以高导热封装互连材料为核心的科技企业。公司专注于以纳米金属产品为代表的半导体用散热封装材料的研发、生产、销售和技术服务,为功率半导体封装、先进集成电路封装提供高散热、高可靠的解决方案。
公司材料研发部门由十余名博士和硕士以及多位实验员组成,成功研制车规级烧结银产品、通讯级烧结银产品、光电封装导热银胶、集成电路用热界面材料”等系列产品。与哈工大 (深圳)共建校企联合实验室,联合培养博士、硕士生,布局更多新产品方向。

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芯源新材 Financing History (7 rounds)

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C轮
Capital Market Favor
Latest Financing Round
  • Date: ?
  • Amount: 融资金额未公开
  • Investor: 小米集团

芯源新材 How Fast Is Hiring Growing? (23 open positions)

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Note: How fast is hiring at 深圳芯源新材料有限公司 growing? 芯源新材2025: 71 openings (up 184%), 2024: 25 openings (up 400%), 2023: 5 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

芯源新材 Master's Degree Job Demand Analysis

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+100%
Growth Rate
2026 vs 2025
芯源新材 Master's Hiring by Year: 2026 — 1 more jobs than 2025
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 深圳芯源新材料有限公司 growing? 芯源新材Master's recruitment over the years: 2026: 2 openings (down 31%), 2025: 1 openings (up 184%).

芯源新材 R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 深圳芯源新材料有限公司? Based on an analysis of 芯源新材's job postings over the past year, "其他(研发和技术类)" demand: 25.8%, "电子/电器/通信技术类": 12.1%, "生物/制药/化工/环保类": 9.1%, "机械/仪器仪表类": 4.5%, "美术/设计/创意类": 3%, "计算机/网络/技术类": 3%. For reference only.

芯源新材 — What Are the Salaries Like? (66 records)

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芯源新材 Salary Overview
salary range: 6K - 50K, 54.6% of roles pay ¥15-30K
Note: salary statistics are based on 66 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 深圳芯源新材料有限公司?芯源新材54.6% of positions earn 15-30K, Undergraduate salary: ¥。其他(研发和技术类) average salary ¥23.9K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of 芯源新材

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Are salaries high at 深圳芯源新材料有限公司? We provide: 研发工程师,助理工程,ae,fa,工艺工程,销售,bp,hr,品质工程,实验员,应用工程师,研发助理,质量,pe,pi,qe,会计,体系工程师,公共关系,操作工. Click to view detailed salary analysis by job.

芯源新材 honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

芯源新材 Related Industry Tags

Job Category

  • 其他(研发和技术类)
    24.6% of total 24.6%
  • 质量管理类
    20.3% of total 20.3%
  • 客户服务类
    18.8% of total 18.8%
  • 工厂生产类
    18.8% of total 18.8%

Education

  • 本科
    52.2% of total 52.2%
  • 大专
    36.2% of total 36.2%
  • 硕士
    4.3% of total 4.3%
  • 高中
    2.9% of total 2.9%

Experience

  • 3-5年
    34.8% of total 34.8%
  • 1-3年
    27.5% of total 27.5%
  • 5-10年
    21.7% of total 21.7%
  • 不限
    15.9% of total 15.9%
View Detailed Analysis

What does 深圳芯源新材料有限公司 require? Who is 芯源新材 hiring? 芯源新材 recruitment: 其他(研发和技术类)占比最多占24.6%,其次是质量管理类占20.3%. What education can get in at 芯源新材? 本科占比最多占52.2%,其次是大专占36.2%. High education required at 芯源新材? 硕士占4.3%,博士占1.4%. Work experience required at 芯源新材? 3-5年占比最多占34.8%,其次是1-3年占27.5%. Where are the job locations at 芯源新材? 深圳占比最多占95.7%,其次是苏州占4.3%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 545万(元)
Legal Representative: 姜亮
Date Established:
Credit Code: 91440300MA5H9LUA06
Registered Address: 深圳市宝安区新安街道兴东社区72区马边工业区11栋厂房3层

Partners & Suppliers

为其提供银烧结材料用于高端封装 Source
合作客户 半导体封装测试
向其供应导电银胶等封装材料 Source
合作客户 半导体封装测试

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