北京芯合半导体有限公司 R&D strength - Jobui

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R&D strength (tech talent demand and pay)

What is the demand for tech talent at ? Based on job postings in the past year, “电子/电器/通信技术类”占32.4%，“机械/仪器仪表类”占17.9%，“其他（研发和技术类）”占12.1%，“计算机/网络/技术类”占10.4%，“生物/制药/化工/环保类”占5.2%，“电气/能源/动力类”占2.3%，“美术/设计/创意类”占1.2%. For reference only.

电子/电器/通信技术类 salary: 75% of positions pay ¥20-50K/month

12.5% 10-15K 30.4% 20-30K 44.6% 30-50K 12.5% 50K以上

电子/电器/通信技术类 talent demand: 56 positions, 32.4%, hot jobs:

Master's degree job demand analysis at (More)

2025: Up 33%

master's hiring over the years:

2024 3 positions 2025 4 positions 2026 ? *** 

* Hiring volume was generally low in 2020-2022 due to the pandemic

Master's salary 򀀩

Talent Demand Trend Analysis More

半导体

功率半导体

第三代半导体

晶圆

芯片

半导体解决方案

IDM

封装

半导体分立器件

半导体设计

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