Company Overview

Development Stage

About the Company

芯合半导体是一家专注于碳化硅功率芯片IDM企业,业务包括芯片设计、晶圆制造、封装测试,产品包括Wafer、SBD器件、MOSFET器件以及全碳化硅模块。公司齐聚了一支技术和产业化经验丰富的核心团队,深耕功率半导体,重点致力于开发碳化硅分立器件和功率模块及应用,为实现高功率密度电能转换系统的高效率、小型化和轻量化提供完整的半导体解决方案。

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Information is aggregated from the web and may not be exact. For reference only.
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How Fast Is Hiring Growing? (34 open positions)

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Note: How fast is hiring at 北京芯合半导体有限公司 growing? 2026: 133 openings (up 14%), 2025: 117 openings (up 550%), 2024: 18 openings (up 1700%), 2023: 1 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

Master's Degree Job Demand Analysis

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Master's Hiring by Year:
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 北京芯合半导体有限公司 growing? Master's recruitment over the years: 2025: 4 openings (up 33%), 2024: 3 openings.

R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 北京芯合半导体有限公司? Based on an analysis of 's job postings over the past year, "电子/电器/通信技术类" demand: 32.4%, "机械/仪器仪表类": 17.9%, "其他(研发和技术类)": 12.1%, "计算机/网络/技术类": 10.4%, "生物/制药/化工/环保类": 5.2%, "电气/能源/动力类": 2.3%. For reference only.

— What Are the Salaries Like? (173 records)

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salary range: 3K - 50K, 75.2% of roles pay ¥20-50K
Note: salary statistics are based on 173 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 北京芯合半导体有限公司?75.2% of positions earn 20-50K, Fresh graduate salary: ¥10.8K。Beijing salary ranking: #801,电子/电器/通信技术类 average salary ¥33.3K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of

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Are salaries high at 北京芯合半导体有限公司? We provide: 工艺工程,设备工,ae,fa,采购,销售,ie,pi,质量,qe,开发工程师,组经理,设备经理,资深工程师,ba,td,ye工程师,产品经理,副总,应用工程师. Click to view detailed salary analysis by job.

Job Category

  • 电子/电器/通信技术类
    32.4% of total 32.4%
  • 工厂生产类
    22.5% of total 22.5%
  • 技工类
    18.5% of total 18.5%
  • 机械/仪器仪表类
    17.9% of total 17.9%

Education

  • 本科
    77.5% of total 77.5%
  • 大专
    16.2% of total 16.2%
  • 硕士
    5.2% of total 5.2%
  • 不限
    1.2% of total 1.2%

Experience

  • 5-10年
    48% of total 48%
  • 3-5年
    32.9% of total 32.9%
  • 不限
    12.7% of total 12.7%
  • 1-3年
    3.5% of total 3.5%
View Detailed Analysis

What does 北京芯合半导体有限公司 require? Who is 北京芯合半导体有限公司 hiring? recruitment: 电子/电器/通信技术类占比最多占32.4%,其次是工厂生产类占22.5%. What education can get in at ? 本科占比最多占77.5%,其次是大专占16.2%. High education required at ? 硕士占5.2%. Work experience required at ? 5-10年占比最多占48%,其次是3-5年占32.9%. Where are the job locations at ? 合肥占比最多占55.5%,其次是北京占37.6%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 45,000万(元)
Legal Representative: 洪伟刚
Date Established:
Credit Code: 91110400MACMKGAJ0Q
Registered Address: 北京市北京经济技术开发区科创十三街18号院6号楼1层103

Partners & Suppliers

向科华数据提供UPS用功率半导体 Source
合作客户 工控与新能源
向英威腾提供功率器件 Source
合作客户 工控与新能源
向阳光电源提供IGBT用于光伏逆变器 Source
合作客户 工控与新能源
向比亚迪提供功率半导体用于新能源汽车 Source
合作客户 工控与新能源
向汇川技术提供IGBT用于变频器 Source
合作客户 工控与新能源

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