芯合半导体是一家专注于碳化硅功率芯片IDM企业,业务包括芯片设计、晶圆制造、封装测试,产品包括Wafer、SBD器件、MOSFET器件以及全碳化硅模块。公司齐聚了一支技术和产业化经验丰富的核心团队,深耕功率半导体,重点致力于开发碳化硅分立器件和功率模块及应用,为实现高功率密度电能转换系统的高效率、小型化和轻量化提供完整的半导体解决方案。
What does 北京芯合半导体有限公司 require? Who is 北京芯合半导体有限公司 hiring? recruitment: 电子/电器/通信技术类占比最多占32.4%,其次是工厂生产类占22.5%. What education can get in at ? 本科占比最多占77.5%,其次是大专占16.2%. High education required at ? 硕士占5.2%. Work experience required at ? 5-10年占比最多占48%,其次是3-5年占32.9%. Where are the job locations at ? 合肥占比最多占55.5%,其次是北京占37.6%. Based on job postings from the past year, for reference only.
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