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Company Overview

Development Stage

About the Company

芯合半导体是一家专注于碳化硅功率芯片IDM企业,业务包括芯片设计、晶圆制造、封装测试,产品包括Wafer、SBD器件、MOSFET器件以及全碳化硅模块。公司齐聚了一支技术和产业化经验丰富的核心团队,深耕功率半导体,重点致力于开发碳化硅分立器件和功率模块及应用,为实现高功率密度电能转换系统的高效率、小型化和轻量化提供完整的半导体解决方案。

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Information is aggregated from the web and may not be exact. For reference only.
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How Fast Is Hiring Growing? (61 open positions)

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Note: How fast is hiring at 北京芯合半导体有限公司 growing? 2025年117个(增长550%),2024年18个(增长1700%),2023年1个. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

Master's Degree Job Demand Analysis

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Master's Hiring by Year:
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 北京芯合半导体有限公司 growing? 历年硕士招聘职位量:2025年4个(增长33%),2024年3个.

R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 北京芯合半导体有限公司? Based on an analysis of 's job postings over the past year, “电子/电器/通信技术类”需求占32.2%,“机械/仪器仪表类”占18.5%,“其他(研发和技术类)”占10.2%,“计算机/网络/技术类”占10.2%,“生物/制药/化工/环保类”占5.4%,“电气/能源/动力类”占2%. For reference only.

— What Are the Salaries Like? (205 records)

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salary range: 3K - 50K, 72.7% of roles pay ¥20-50K
Note: salary statistics are based on 205 salary records from the past year and depend on the job sample. For reference only.
北京芯合半导体有限公司工资待遇怎么样?72.7%的岗位拿20-50K,应届生工资¥9.6K。北京地区工资排名第874,与同行业比+23%,电子/电器/通信技术类平均工资¥32.5K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of

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Are salaries high at 北京芯合半导体有限公司? We provide: 工艺工程,设备工,ae,采购,fa,销售,ie,pi,qe,应用工程师,开发工程师,组经理,质量,td,副总,设备经理,资深工程师,ba,qa,ye工程师. Click to view detailed salary analysis by job.

Job Category

  • 电子/电器/通信技术类
    32.2% of total 32.2%
  • 工厂生产类
    22.4% of total 22.4%
  • 质量管理类
    20% of total 20%
  • 技工类
    18.5% of total 18.5%

Education

  • 本科
    78% of total 78%
  • 大专
    15.1% of total 15.1%
  • 硕士
    4.9% of total 4.9%
  • 不限
    2% of total 2%

Experience

  • 5-10年
    48.3% of total 48.3%
  • 3-5年
    34.1% of total 34.1%
  • 不限
    11.7% of total 11.7%
  • 应届生
    2.9% of total 2.9%
View Detailed Analysis

What does 北京芯合半导体有限公司 require? Who is 北京芯合半导体有限公司 hiring? 招聘类别电子/电器/通信技术类占比最多占32.2%,其次是工厂生产类占22.4%。什么学历能进?本科占比最多占78%,其次是大专占15.1%。学历要求高吗?硕士占4.9%。工作经验有什么要求?5-10年占比最多占48.3%,其次是3-5年占34.1%。工作地区在哪?合肥占比最多占56.6%,其次是北京占37.6%。 Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 45,000万(元)
Legal Representative: 洪伟刚
Date Established:
Credit Code: 91110400MACMKGAJ0Q
Registered Address: 北京市北京经济技术开发区科创十三街18号院6号楼1层103

Partners & Suppliers

向科华数据提供UPS用功率半导体 Source
合作客户 工控与新能源
向英威腾提供功率器件 Source
合作客户 工控与新能源
向阳光电源提供IGBT用于光伏逆变器 Source
合作客户 工控与新能源
向比亚迪提供功率半导体用于新能源汽车 Source
合作客户 工控与新能源
向汇川技术提供IGBT用于变频器 Source
合作客户 工控与新能源

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