Company Overview

Development Stage

About the Company

[Summary] 半导体封装测试服务提供商

江苏芯德半导体科技有限公司成立于2020年09月11日,是一家新成立的半导体公司,位于南京市浦口区浦口经济开发区双峰路69号A-11。主要以移动互联网产品为核心,为客户提供一站式高端的中道和后道的封装和测试服务。整个项目计划总投资60亿元,一期项目建设54000平方米标准化厂房,二期项目将建设占地约160亩的芯片封装测试基地。目前一期项目正在有条不紊的建设中,预计2021年5月份进行试样生产,第三季度可实现量产。待项目全面达成后,年产值将突破50亿元。

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芯德半导体 Financing History (2 rounds)

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D轮
Capital Market Favor
Latest Financing Round
  • Date: ?
  • Amount: 4亿人民币
  • Investor: 元禾璞华,江苏高投,雨山资...

芯德半导体 How Fast Is Hiring Growing? (18 open positions)

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Growth Rate
2026 vs 2025
  • 2025: Up 318%
  • 2024: Up 10%
  • 2023: Down 33%
  • 2022: Up 114%
芯德半导体 Year-by-Year Hiring:
* Hiring was generally low during 2020-2022 due to the pandemic
Note: How fast is hiring at 江苏芯德半导体科技股份有限公司 growing? 芯德半导体2025: 46 openings (up 318%), 2024: 11 openings (up 10%), 2023: 10 openings (down 33%), 2022: 15 openings (up 114%), 2021: 7 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

芯德半导体 — What Are the Salaries Like? (40 records)

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芯德半导体 Salary Overview
salary range: 4.5K - 30K, 57.5% of roles pay ¥6-10K
Note: salary statistics are based on 40 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 江苏芯德半导体科技股份有限公司?芯德半导体57.5% of positions earn 6-10K, Undergraduate salary: ¥。工厂生产类 average salary ¥9.4K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of 芯德半导体

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Are salaries high at 江苏芯德半导体科技股份有限公司? We provide: 工艺工程,pe,助理工程,生产助理,qe,操作工,测试工程,设备工,销售助理,pi,pr,qa,产品工程,人事助理,仓管,化验,培训,客服,开发助理,开发工程师. Click to view detailed salary analysis by job.

芯德半导体 honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

芯德半导体 Related Industry Tags

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Job Category

  • 工厂生产类
    37.5% of total 37.5%
  • 客户服务类
    25% of total 25%
  • 技工类
    25% of total 25%
  • 质量管理类
    22.5% of total 22.5%

Education

  • 本科
    62.5% of total 62.5%
  • 大专
    25% of total 25%
  • 不限
    10% of total 10%
  • 高中
    2.5% of total 2.5%

Experience

  • 不限
    50% of total 50%
  • 1-3年
    22.5% of total 22.5%
  • 3-5年
    20% of total 20%
  • 5-10年
    7.5% of total 7.5%
View Detailed Analysis

What does 江苏芯德半导体科技股份有限公司 require? Who is 芯德半导体 hiring? 芯德半导体 recruitment: 工厂生产类占比最多占37.5%,其次是客户服务类占25%. What education can get in at 芯德半导体? 本科占比最多占62.5%,其次是大专占25%. Work experience required at 芯德半导体? 不限占比最多占50%,其次是1-3年占22.5%. Where are the job locations at 芯德半导体? 南京占比最多占95%,其次是扬州占2.5%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 95,906.1732万(元)
Legal Representative: 张国栋
Date Established:
Credit Code: 91320111MA22EAY02W
Registered Address: 南京市浦口区浦口经济开发区林春路8号

Partners & Suppliers

芯德半导体为汇顶科技提供指纹识别芯片封测服务 Source
合作客户 芯片设计/IP
芯德半导体从武汉新芯采购晶圆进行封测 Source
供应商 晶圆代工
芯德半导体采购住友电木的封装材料 Source
供应商 封装材料
芯德半导体采购信越化学的环氧塑封料 Source
供应商 封装材料
芯德半导体采购Disco的划片机等设备 Source
供应商 封测设备

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芯德半导体 Competitors (Similar Companies)

半导体 集成电路/IC 芯片测试 芯片
晶圆代工 半导体 积体电路制造 生产
半导体 芯片 模拟芯片 雷达
“高端封装基板产品生产商”
半导体 芯片封装 集成电路/IC 集成电路封装测试
微机电系统/MEMS 光电子 芯片 集成电路/IC
“Manufacturing of high-end intelligent machinery equipment and core con”
半导体 集成电路/IC 芯粒chiplet 封测
“Providing customers with more competitive "China Chip" solutions”
光电子 5G 光通信 物联网/IoT
“Electrical engineering solution provider”
“硅光集成光谱仪及解决方案研发提供商”
“An overall solution provider of energy internet with energy power inte”
“One-stop chip finished product manufacturing service”
“提供一流的钴产品”

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