Company Overview

Development Stage

About the Company

[Summary] 8-inch wafer foundry enterprise

Hejian Chip Manufacturing (Suzhou) Co., Ltd. is an 8-inch wafer foundry enterprise, located in Suzhou Industrial Park, officially put into production in May 2003, with a current monthly output of nearly 80,000 wafers and over 2,000 employees.
Hejian provides mainstream logic, mixed-signal, embedded non-volatile memory, high-voltage, and image sensor processes from 0.5 micron to 110 nanometers. It also offers professional one-stop production services and consulting, ranging from design services, mask making, wafer production to packaging and testing. Its foundry products mainly target consumer, automotive, and industrial electronics, covering liquid crystal drivers, microprocessors, power management, fingerprint recognition, smart cards, identity recognition, and other security products.
Adhering to the business philosophy of customer first and growing together with customers, the company provides competitive wafer foundry manufacturing services. Its production cycle and quality assurance are recognized by customers. Additionally, it supports multi-project wafers (MPW) and IP services. Hejian has a senior, professional technical and management team that can share experience with customers in new product development, solution design, and other areas.
The company is committed to expanding the mainstream product market, developing more advanced and special-application process technologies, and continuously expanding capacity to meet market demand.

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Information is aggregated from the web and may not be exact. For reference only.
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Hejian Chip Products & Services (4 in total)

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非挥发性工艺技术
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混合信号/射频电路
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高压工艺技术
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0.11微米逻辑
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Hejian Chip How Fast Is Hiring Growing? (4 open positions)

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Growth Rate
2026 vs 2025
  • 2025: Down 18%
  • 2024: Down 35%
  • 2023: Up 42%
  • 2022: Down 78%
Hejian Chip Year-by-Year Hiring:
* Hiring was generally low during 2020-2022 due to the pandemic
Hejian Chip Campus Recruitment & Advanced Degree Talent Demand
Master's 1
Note: How fast is hiring at Hejian Chip Manufacturing (Suzhou) Co., Ltd. growing? Hejian Chip2026: 10 openings (up 11%), 2025: 9 openings (down 18%), 2024: 11 openings (down 35%), 2023: 17 openings (up 42%), 2022: 12 openings (down 78%), 2021: 54 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

Hejian Chip — What Are the Salaries Like? (10 records)

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Hejian Chip Salary Overview
salary range: 4.5K - 20K, 70% of roles pay ¥6-15K
Note: salary statistics are based on 10 salary records from the past year and depend on the job sample. For reference only.
How is the salary at Hejian Chip Manufacturing (Suzhou) Co., Ltd.?Hejian Chip70% of positions earn 6-15K, Undergraduate salary: ¥。其他(研发和技术类) average salary ¥12.4K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Hejian Chip honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

Hejian Chip Related Industry Tags

Job Category

  • 其他(研发和技术类)
    40% of total 40%
  • 技工类
    30% of total 30%
  • 机械/仪器仪表类
    30% of total 30%
  • 电子/电器/通信技术类
    20% of total 20%

Education

  • 本科
    60% of total 60%
  • 硕士
    30% of total 30%
  • 高中
    10% of total 10%

Experience

  • 不限
    90% of total 90%
  • 3-5年
    10% of total 10%
View Detailed Analysis

What does Hejian Chip Manufacturing (Suzhou) Co., Ltd. require? Who is Hejian Chip hiring? Hejian Chip recruitment: 其他(研发和技术类)占比最多占40%,其次是技工类占30%. What education can get in at Hejian Chip? 本科占比最多占60%,其次是硕士占30%. High education required at Hejian Chip? 硕士占30%. Work experience required at Hejian Chip? 不限占比最多占90%,其次是3-5年占10%. Where are the job locations at Hejian Chip? 苏州占比最多占100%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 314,524.57万(元)
Legal Representative: 刘启东
Date Established:
Credit Code: 91320594732513557J
Registered Address: 中国(江苏)自由贸易试验区苏州片区苏州工业园区星华街333号

Partners & Suppliers

晶圆代工供应商,提供显示驱动芯片晶圆 Source
合作客户 晶圆代工
捷捷半导体委托和舰芯片进行部分晶圆代工 Source
合作客户 晶圆代工
提供成熟制程晶圆代工服务 Source
合作客户 芯片代工
提供晶圆代工用清洗剂和刻蚀液 Source
供应商 芯片代工
提供超纯化学品,用于成熟制程代工 Source
供应商 集成电路晶圆代工

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印刷电路板/PCB 工业控制 计算机 学生用品
“信号链芯片及其解决方案提供商”
“A high-tech integrated circuit chip foundry enterprise”
半导体 晶圆制造 功率器件 第三代半导体
“电热设备制造商”
“The company's products focus on power semiconductors and smart sensors”
光电材料 化合物半导体 特种气体 光刻胶
轴承 发动机 液压油 机床
“功率及数模混合芯片设计”
企业管理 猎头 服务外包 蓝领
“半导体通讯及传感芯片研发制造商”
“致力于电子半导体材料, 深冷复合材料以及塑料助剂材料研发和生产。”
五金厂/五金 模具制造 模具 密封测试仪

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