Hefei Jinghe Integrated Circuit Co., Ltd. News

News of Jinghe Integration

合肥晶合集成电路股份有限公司向港交所提交上市申请书

From 36氪 2026-04-01 07:36:03

晶合集成：拟20亿元取得晶奕集成100%股权

From 36氪 2026-02-06 18:01:04

合肥晶合集成电路股份有限公司向港交所提交上市申请书

From 36氪 2025-09-29 16:13:03

晶合集成：拟发行境外上市股份（H股）

From 36氪 2025-08-28 19:43:04

晶合集成：正在筹划发行H股并在香港联合交易所上市

From 36氪 2025-08-01 17:02:02

晶合集成：40纳米oled显示驱动芯片已正式流片，28纳米产品开发正在推进中

From 36氪 2024-02-02 15:21:55

晶合集成：55nm触控与显示驱动集成芯片（tddi）实现大规模量产

From 36氪 2023-06-20 16:12:48

晶合集成：公司股票将于5月5日在科创板ipo上市

From 36氪 2023-05-03 16:16:34

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Talent Demand Trend Analysis More

半导体

芯片制造

晶圆代工

代加工

芯片代工

集成电路制造

微电子

电子设备

能源芯片

处理器芯片

电子元件

半导体设计

半导体显示面板

显示面板

半导体硅晶片

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Hefei公司排名  Hefei“Xinzhan District”公司排名  Hefei“半导体”公司排名  Hefei“代加工”公司排名  Hefei“微电子”公司排名  Hefei“电子设备”公司排名  Hefei“处理器芯片”公司排名  附近的公司 

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News of Jinghe Integration

合肥晶合集成电路股份有限公司向港交所提交上市申请书

晶合集成：拟20亿元取得晶奕集成100%股权

合肥晶合集成电路股份有限公司向港交所提交上市申请书

晶合集成：拟发行境外上市股份（H股）

晶合集成：正在筹划发行H股并在香港联合交易所上市

晶合集成：40纳米oled显示驱动芯片已正式流片，28纳米产品开发正在推进中

晶合集成：55nm触控与显示驱动集成芯片（tddi）实现大规模量产

晶合集成：公司股票将于5月5日在科创板ipo上市

Talent Demand Trend Analysis More

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ChangXin Technology Group Co., Ltd.

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