Aochuangpu

Hunan Aochuangpu Technology Co., Ltd. is located at the China Electronics Great Wall Headquarters Base in Yuelu District, Changsha City, Hunan Province. It is a standing council member of the Hunan Optical Society and a council member of the Hunan Semiconductor Association. The company was jointly founded by senior industry experts. Its R&D and industrialization of semiconductor optoelectronic chip defect AOI machines and packaging die bonders rank first in China and have surpassed foreign technologies, defeating foreign competitors; it is also actively positioning itself in inspection and die bonding equipment for advanced packaging and SiP packaging (flip-chip packaging). The company integrates core technologies such as "nanometer-level ultra-precision mechanical design and manufacturing + complex motion control + precision optics + AI software algorithms + advanced packaging and die bonding technology," successfully breaking the monopoly of foreign equipment and filling the gap in related domestic equipment. Its core R&D team has many years of experience in the development, installation, and debugging of ultra-precision equipment, and its vision algorithm team is composed of senior industry experts. The company specializes in the R&D, manufacturing, sales, and service of fully automatic chip AOI intelligent inspection equipment and high-precision automatic assembly equipment. Its products can be widely used in industries such as semiconductors, 3C, new energy, aerospace, and medical devices.

R&D strength:
· Hardcore technology: Independently developed 30nm resolution imaging technology, the first in China to complete 100X high-precision imaging and inspection, with nanoscale defect detection benchmarked against top international standards; inspection + automatic contamination cleaning integration, achieving a 0-1 breakthrough in the domestic industry; 100+ patents.
· Strong team: The core technical team brings together outstanding talents from well-known domestic universities such as Wuhan University, Tianjin University, Sichuan University, South China University of Technology, and Central South University, and possesses rich industry experience. Many core members of the team have worked at internationally renowned companies such as ASM, OMRON, and SIEMENS, with global vision and advanced technical strength.
· Industry breakthrough: Core supplier for the R&D and industrialization production line of China's first COC inspection + automatic contamination cleaning all-in-one machine, nanoscale AOI defect inspection equipment, and micron-level high-precision die bonders for advanced packaging, serving leading domestic optoelectronic chip manufacturing and packaging enterprises such as Raycus Laser (300747), Changguang Huaxin (688048), Shijia Photons (688313), Yuanjie Technology (688498), Kailaser, Chuangxin Laser, and XianDao Group.
· Ecological empowerment: Annual R&D investment exceeds ten million yuan, jointly tackling key problems with Central South University, Hunan University, and University of Science and Technology, actively cooperating with universities and research institutes, and promoting deep integration of industry, academia, and research.

Join us and you will gain:
1. Technical challenges: Deeply participate in the battle to "replace imports" in domestic semiconductor equipment, lead the R&D of high-precision AOI inspection equipment and nanoscale placement equipment, and break through "bottleneck" technical problems such as 3D packaging defect detection and submicron motion control.
2. Development space: As a technical core, directly participate in the company's strategic planning, be promoted to senior scientist/technical partner, and lead the initiation of tens-of-millions-level R&D projects.
3. Equity incentives: With the company's IPO or strategic financing, realize the capitalization multiplier of technical value and share in the tens-of-billions-level market dividend.
4. Career development—dual-channel promotion:
· Technical channel: Senior Engineer → Expert Engineer → Senior Expert Engineer → Senior Technical Expert
· Management channel: Project Manager → Business Unit Head → Company Executive
· Technical exchange: Selected to study and exchange at cooperative customers or overseas research institutions